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Home > England & Wales Companies > IQE SILICON COMPOUNDS LIMITED
Company Information for

IQE SILICON COMPOUNDS LIMITED

BEECH HOUSE PASCAL CLOSE, ST MELLONS, CARDIFF, SOUTH GLAMORGAN, CF3 0LW,
Company Registration Number
03986643
Private Limited Company
Active

Company Overview

About Iqe Silicon Compounds Ltd
IQE SILICON COMPOUNDS LIMITED was founded on 2000-05-05 and has its registered office in Cardiff. The organisation's status is listed as "Active". Iqe Silicon Compounds Limited is a Private Limited Company registered in with Companies House and the accounts submission requirement is categorised as AUDIT EXEMPTION SUBSIDIARY
Key Data
Company Name
IQE SILICON COMPOUNDS LIMITED
 
Legal Registered Office
BEECH HOUSE PASCAL CLOSE
ST MELLONS
CARDIFF
SOUTH GLAMORGAN
CF3 0LW
Other companies in CF3
 
Filing Information
Company Number 03986643
Company ID Number 03986643
Date formed 2000-05-05
Country 
Origin Country United Kingdom
Type Private Limited Company
CompanyStatus Active
Lastest accounts 31/12/2023
Account next due 30/09/2025
Latest return 05/05/2016
Return next due 02/06/2017
Type of accounts AUDIT EXEMPTION SUBSIDIARY
VAT Number /Sales tax ID GB771290625  
Last Datalog update: 2024-11-05 13:24:48
Primary Source:Companies House
There are multiple companies registered at this address, the registered address may be the accountant's offices for IQE SILICON COMPOUNDS LIMITED
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Company Officers of IQE SILICON COMPOUNDS LIMITED

Current Directors
Officer Role Date Appointed
JASON MARK HOWELLS
Company Secretary 2017-07-20
ANDREW WILLIAM NELSON
Director 2000-12-01
Previous Officers
Officer Role Date Appointed Date Resigned
PHILLIP JOHN RASMUSSEN
Company Secretary 2009-01-19 2018-04-01
JAMES LESLIE COVENTRY
Company Secretary 2000-12-01 2009-01-16
PHILLIP JOHN RASMUSSEN
Director 2008-01-18 2008-10-22
STEPHEN BYARS
Director 2000-12-01 2003-03-07
FILBUK (SECRETARIES) LIMITED
Nominated Secretary 2000-05-05 2000-12-01
FILBUK NOMINEES LIMITED
Nominated Director 2000-05-05 2000-12-01

Related Directorships

Officer Related Company Role Date Appointed Role StatusIncorporation dateCompany Status
ANDREW WILLIAM NELSON COMPOUND SEMICONDUCTOR CENTRE LIMITED Director 2014-09-09 CURRENT 2014-09-09 Active
ANDREW WILLIAM NELSON LLANSANNOR MANAGEMENT CONSULTANTS LTD Director 2012-07-27 CURRENT 2012-07-27 Active
ANDREW WILLIAM NELSON OYSTER INNOVATIONS LIMITED Director 2012-04-17 CURRENT 2012-02-14 Active
ANDREW WILLIAM NELSON NANOGAN LIMITED Director 2009-10-07 CURRENT 2007-03-26 Active
ANDREW WILLIAM NELSON LLANSANNOR HOUSE HOLDINGS LIMITED Director 2009-03-23 CURRENT 2009-03-23 Active
ANDREW WILLIAM NELSON TRUELUX GROUP LIMITED Director 2009-03-23 CURRENT 2009-03-23 Active
ANDREW WILLIAM NELSON WAFER TECHNOLOGY INTERNATIONAL LIMITED Director 2000-11-22 CURRENT 1994-05-12 Active
ANDREW WILLIAM NELSON WAFER TECHNOLOGY LIMITED Director 2000-11-22 CURRENT 1984-07-03 Active
ANDREW WILLIAM NELSON IQE PLC Director 1999-04-13 CURRENT 1999-04-01 Active
ANDREW WILLIAM NELSON EPI HOLDINGS LIMITED Director 1996-05-24 CURRENT 1996-03-11 Active
ANDREW WILLIAM NELSON IQE (EUROPE) LIMITED Director 1992-10-26 CURRENT 1987-03-09 Active

More director information

Corporation Filing History
Companies House Filing History
This is a record of the public documents (corporate filing) lodged from Companies House where the company has filed annual returns and other statutory filing documents. Examples of documents filed include: change of registered office, accounts filing, director/officer appointments & resignations, changes in share capital, shareholder members lists etc.

DateDocument TypeDocument Description
2024-11-18APPOINTMENT TERMINATED, DIRECTOR AMERICO LEMOS
2024-08-28Audit exemption statement of guarantee by parent company for period ending 31/12/23
2024-08-28Notice of agreement to exemption from audit of accounts for period ending 31/12/23
2024-08-28Consolidated accounts of parent company for subsidiary company period ending 31/12/23
2024-08-28Audit exemption subsidiary accounts made up to 2023-12-31
2024-05-08CONFIRMATION STATEMENT MADE ON 05/05/24, WITH NO UPDATES
2024-02-13APPOINTMENT TERMINATED, DIRECTOR NEIL JOHN RUMMINGS
2024-02-13DIRECTOR APPOINTED JUTTA MEIER
2023-09-08Audit exemption statement of guarantee by parent company for period ending 31/12/22
2023-09-08Notice of agreement to exemption from audit of accounts for period ending 31/12/22
2023-09-08Consolidated accounts of parent company for subsidiary company period ending 31/12/22
2023-09-08Audit exemption subsidiary accounts made up to 2022-12-31
2023-06-16DIRECTOR APPOINTED MR NEIL JOHN RUMMINGS
2023-06-13APPOINTMENT TERMINATED, DIRECTOR TIMOTHY NEIL PULLEN
2022-10-01Notice of agreement to exemption from audit of accounts for period ending 31/12/21
2022-10-01Audit exemption statement of guarantee by parent company for period ending 31/12/21
2022-10-01Consolidated accounts of parent company for subsidiary company period ending 31/12/21
2022-10-01Audit exemption subsidiary accounts made up to 2021-12-31
2022-01-24DIRECTOR APPOINTED MR AMERICO LEMOS
2020-10-05PARENT_ACCConsolidated accounts of parent company for subsidiary company period ending 31/12/19
2020-10-05AGREEMENT2Notice of agreement to exemption from audit of accounts for period ending 31/12/19
2020-10-05GUARANTEE2Audit exemption statement of guarantee by parent company for period ending 31/12/19
2020-05-11CS01CONFIRMATION STATEMENT MADE ON 05/05/20, WITH UPDATES
2020-03-30CH01Director's details changed for Dr Andrew William Nelson on 2009-10-01
2020-03-23AP03Appointment of Mr Thomas Andrew Dale as company secretary on 2020-03-19
2020-01-28TM02Termination of appointment of Jason Mark Howells on 2019-12-20
2019-08-30MR01REGISTRATION OF A CHARGE / CHARGE CODE 039866430011
2019-08-05PARENT_ACCConsolidated accounts of parent company for subsidiary company period ending 31/12/18
2019-07-11AGREEMENT2Notice of agreement to exemption from audit of accounts for period ending 31/12/18
2019-06-26TM01APPOINTMENT TERMINATED, DIRECTOR GODFREY HOWARD HARRISON AINSWORTH
2019-05-08CS01CONFIRMATION STATEMENT MADE ON 05/05/19, WITH NO UPDATES
2019-03-28AP01DIRECTOR APPOINTED MR TIMOTHY NEIL PULLEN
2019-03-21GUARANTEE2Audit exemption statement of guarantee by parent company for period ending 31/12/18
2019-03-19MEM/ARTSARTICLES OF ASSOCIATION
2019-03-19RES13Resolutions passed:
  • Re-transactions, facility agreement,guarantee 21/01/2019
  • ALTER ARTICLES
2019-02-22PSC05Change of details for Iqe Plc as a person with significant control on 2016-04-06
2019-02-11RES13Resolutions passed:
  • Re-transactions/finance documents 21/01/2019
  • ALTER ARTICLES
2019-02-04MR01REGISTRATION OF A CHARGE / CHARGE CODE 039866430010
2018-10-10PARENT_ACCConsolidated accounts of parent company for subsidiary company period ending 31/12/17
2018-10-10AGREEMENT2Notice of agreement to exemption from audit of accounts for period ending 31/12/17
2018-09-25AP01DIRECTOR APPOINTED DR GODFREY HOWARD HARRISON AINSWORTH
2018-05-11CS01CONFIRMATION STATEMENT MADE ON 05/05/18, WITH NO UPDATES
2018-04-11GUARANTEE2Audit exemption statement of guarantee by parent company for period ending 31/12/17
2018-04-10TM02Termination of appointment of Phillip John Rasmussen on 2018-04-01
2017-10-25AGREEMENT2Notice of agreement to exemption from audit of accounts for period ending 31/12/16
2017-10-11PARENT_ACCConsolidated accounts of parent company for subsidiary company period ending 31/12/16
2017-07-20AP03Appointment of Mr Jason Mark Howells as company secretary on 2017-07-20
2017-05-09LATEST SOC09/05/17 STATEMENT OF CAPITAL;GBP 2
2017-05-09CS01CONFIRMATION STATEMENT MADE ON 05/05/17, WITH UPDATES
2017-03-11GUARANTEE2Audit exemption statement of guarantee by parent company for period ending 31/12/16
2016-10-17PARENT_ACCConsolidated accounts of parent company for subsidiary company period ending 31/12/15
2016-10-17AGREEMENT2Notice of agreement to exemption from audit of accounts for period ending 31/12/15
2016-05-05LATEST SOC05/05/16 STATEMENT OF CAPITAL;GBP 2
2016-05-05AR0105/05/16 ANNUAL RETURN FULL LIST
2016-03-29GUARANTEE2Audit exemption statement of guarantee by parent company for period ending 31/12/15
2015-08-21PARENT_ACCConsolidated accounts of parent company for subsidiary company period ending 31/12/14
2015-08-21AGREEMENT2Notice of agreement to exemption from audit of accounts for period ending 31/12/14
2015-08-15MR05STATEMENT OF RELEASE / CEASE FROM CHARGE / PART RELEASE / CHARGE NO 7
2015-08-06MR01REGISTRATION OF A CHARGE / CHARGE CODE 039866430008
2015-05-22LATEST SOC22/05/15 STATEMENT OF CAPITAL;GBP 2
2015-05-22AR0105/05/15 FULL LIST
2015-04-08GUARANTEE2AUDIT EXEMPTION STATEMENT OF GUARANTEE BY PARENT COMPANY FOR PERIOD ENDING 31/12/14
2014-09-17AAAUDIT EXEMPTION SUBSIDIARY ACCOUNTS MADE UP TO 31/12/13
2014-09-17PARENT_ACCCONSOLIDATED ACCOUNTS OF PARENT COMPANY FOR SUBSIDIARY COMPANY PERIOD ENDING 31/12/13
2014-09-17AGREEMENT2NOTICE OF AGREEMENT TO EXEMPTION FROM AUDIT OF ACCOUNTS FOR PERIOD ENDING 31/12/13
2014-05-08LATEST SOC08/05/14 STATEMENT OF CAPITAL;GBP 2
2014-05-08AR0105/05/14 FULL LIST
2014-03-19GUARANTEE2AUDIT EXEMPTION STATEMENT OF GUARANTEE BY PARENT COMPANY FOR PERIOD ENDING 31/12/13
2013-09-30AAFULL ACCOUNTS MADE UP TO 31/12/12
2013-06-18AR0105/05/13 FULL LIST
2012-10-05AAFULL ACCOUNTS MADE UP TO 31/12/11
2012-05-17AR0105/05/12 FULL LIST
2011-10-26MG02DECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 5
2011-10-26MG02DECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 6
2011-07-04AAFULL ACCOUNTS MADE UP TO 31/12/10
2011-05-25MG01PARTICULARS OF A MORTGAGE OR CHARGE / CHARGE NO: 7
2011-05-13AR0105/05/11 FULL LIST
2010-10-01AAFULL ACCOUNTS MADE UP TO 31/12/09
2010-05-24AR0105/05/10 FULL LIST
2009-11-03AAFULL ACCOUNTS MADE UP TO 31/12/08
2009-05-13363aRETURN MADE UP TO 05/05/09; FULL LIST OF MEMBERS
2009-04-02288aSECRETARY APPOINTED MR PHILLIP JOHN RASMUSSEN
2009-03-23288bAPPOINTMENT TERMINATED SECRETARY JAMES COVENTRY
2008-11-11AAFULL ACCOUNTS MADE UP TO 31/12/07
2008-10-22288bAPPOINTMENT TERMINATED DIRECTOR PHILLIP RASMUSSEN
2008-05-08363aRETURN MADE UP TO 05/05/08; FULL LIST OF MEMBERS
2008-05-07190LOCATION OF DEBENTURE REGISTER
2008-05-07353LOCATION OF REGISTER OF MEMBERS
2008-05-07287REGISTERED OFFICE CHANGED ON 07/05/2008 FROM BEECH HOUSE CYPRESS DRIVE ST. MELLONS CARDIFF CF3 0LW
2008-04-16403aDECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 4
2008-02-01395PARTICULARS OF MORTGAGE/CHARGE
2008-01-29395PARTICULARS OF MORTGAGE/CHARGE
2008-01-23288aNEW DIRECTOR APPOINTED
2008-01-15403aDECLARATION OF SATISFACTION OF MORTGAGE/CHARGE
2008-01-15403aDECLARATION OF SATISFACTION OF MORTGAGE/CHARGE
2008-01-15403aDECLARATION OF SATISFACTION OF MORTGAGE/CHARGE
2007-10-30AAFULL ACCOUNTS MADE UP TO 31/12/06
2007-06-01363(190)LOCATION OF DEBENTURE REGISTER ADDRESS CHANGED
2007-06-01363sRETURN MADE UP TO 05/05/07; NO CHANGE OF MEMBERS
2006-08-22AAFULL ACCOUNTS MADE UP TO 31/12/05
2006-05-15363sRETURN MADE UP TO 05/05/06; FULL LIST OF MEMBERS
2005-11-19395PARTICULARS OF MORTGAGE/CHARGE
2005-05-18AAFULL ACCOUNTS MADE UP TO 31/12/04
2005-05-11363sRETURN MADE UP TO 05/05/05; FULL LIST OF MEMBERS
2004-08-03AAFULL ACCOUNTS MADE UP TO 31/12/03
2004-05-12363(288)DIRECTOR'S PARTICULARS CHANGED
2004-05-12363sRETURN MADE UP TO 05/05/04; FULL LIST OF MEMBERS
2003-07-29AAFULL ACCOUNTS MADE UP TO 31/12/02
2003-05-10363sRETURN MADE UP TO 05/05/03; FULL LIST OF MEMBERS
2003-03-12288bDIRECTOR RESIGNED
2002-07-18AAFULL ACCOUNTS MADE UP TO 31/12/01
2002-05-16363(288)DIRECTOR'S PARTICULARS CHANGED
2002-05-16363sRETURN MADE UP TO 05/05/02; FULL LIST OF MEMBERS
2002-02-23395PARTICULARS OF MORTGAGE/CHARGE
2001-07-30AAFULL ACCOUNTS MADE UP TO 31/12/00
2001-05-17363sRETURN MADE UP TO 05/05/01; FULL LIST OF MEMBERS
2001-02-26225ACC. REF. DATE SHORTENED FROM 31/05/01 TO 31/12/00
2001-01-17287REGISTERED OFFICE CHANGED ON 17/01/01 FROM: FITZALAN HOUSE FITZALAN ROAD CARDIFF SOUTH GLAMORGAN CF24 0EE
2001-01-17288bSECRETARY RESIGNED
2001-01-17288bDIRECTOR RESIGNED
2001-01-09288aNEW SECRETARY APPOINTED
2001-01-09288aNEW DIRECTOR APPOINTED
2001-01-09288aNEW DIRECTOR APPOINTED
2001-01-06395PARTICULARS OF MORTGAGE/CHARGE
2000-12-21395PARTICULARS OF MORTGAGE/CHARGE
2000-11-28MEM/ARTSMEMORANDUM OF ASSOCIATION ARTICLES OF ASSOCIATION
Industry Information
SIC/NAIC Codes
26 - Manufacture of computer, electronic and optical products
261 - Manufacture of electronic components and boards
26110 - Manufacture of electronic components

72 - Scientific research and development
721 - Research and experimental development on natural sciences and engineering
72190 - Other research and experimental development on natural sciences and engineering



Licences & Regulatory approval
We could not find any licences issued to IQE SILICON COMPOUNDS LIMITED or authorisation from an industry specific regulator to operate. These may not be required.
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Risks
Legal Notices
No legal notices or events such as winding-up orders or proposals to strike-off have been issued
Fines / Sanctions
No fines or sanctions have been issued against IQE SILICON COMPOUNDS LIMITED
Liabilities
Mortgages / Charges
Total # Mortgages/Charges 11
Mortgages/Charges outstanding 5
Mortgages Partially Satisifed 0
Mortgages Satisfied/Paid 6
Details of Mortgagee Charges
Charge Type Date of Charge Charge Status Mortgagee
2015-08-01 Outstanding HSBC BANK PLC
DEBENTURE 2011-05-25 PART of the property or undertaking has been released from charge HSBC BANK PLC
DEBENTURE 2008-01-24 Satisfied LLOYDS TSB BANK PLC
OMNIBUS GUARANTEE AND SET-OFF AGREEMENT 2008-01-24 Satisfied LLOYDS TSB BANK PLC
GUARANTEE & DEBENTURE 2005-11-07 Satisfied BARCLAYS BANK PLC
EQUIPMENT MORTGAGE 2002-02-07 Satisfied ING LEASE (UK) LIMITED
EQUIPMENT MORTGAGE 2000-12-21 Satisfied ING LEASE (UK) LTD
EQUIPMENT MORTGAGE 2000-12-15 Satisfied ING LEASE (UK) LIMITED
Intangible Assets
Patents

Intellectual Property Patents Registered by IQE SILICON COMPOUNDS LIMITED

IQE SILICON COMPOUNDS LIMITED has registered 5 patents

GB2501432 , GB2467934 , GB2420222 , GB2467935 , GB2411047 ,

Domain Names
We do not have the domain name information for IQE SILICON COMPOUNDS LIMITED
Trademarks
We have not found any records of IQE SILICON COMPOUNDS LIMITED registering or being granted any trademarks
Income
Government Income
We have not found government income sources for IQE SILICON COMPOUNDS LIMITED. This could be because the transaction value was below £ 500 with local government or below £ 25,000 for central government. We have found 8,000 supplier to government that are UK companies so approx 0.2% of companies listed on Datalog supply to government.

The top companies supplying to UK government with the same SIC code (26110 - Manufacture of electronic components) as IQE SILICON COMPOUNDS LIMITED are:

Outgoings
Business Rates/Property Tax
No properties were found where IQE SILICON COMPOUNDS LIMITED is liable for the business rates / property tax. This could be for a number of reasons.
  • The council hasnt published the data
  • We havent found or been able to process the councils data
  • The company is part of a group of companies and another company in the group is liable for business rates
  • The registered office may be a residential address which does not have a commercial designation. If the business is run from home then it won't be a commercial property and hence won't be liable for business rates.
  • Serviced offices are increasingly popular and therefore a business may not be paying business rates directly - the building owner is and this is incorporated in the office rental charge.
Import/Export of Goods
Goods imported/exported by IQE SILICON COMPOUNDS LIMITED
OriginDestinationDateImport CodeImported Goods classification description
2015-07-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-07-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-07-0185415000Semiconductor devices, n.e.s.
2015-07-0185429000Parts of electronic integrated circuits, n.e.s.
2015-06-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-06-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2015-06-0185429000Parts of electronic integrated circuits, n.e.s.
2015-05-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-05-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-05-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2015-05-0185429000Parts of electronic integrated circuits, n.e.s.
2015-05-0190258080Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic
2015-04-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-04-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2015-04-0185429000Parts of electronic integrated circuits, n.e.s.
2015-03-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-03-0190258080Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic
2015-03-0190308200Instruments and apparatus for measuring or checking semiconductor wafers or devices
2015-02-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-01-0128500020Hydrides and nitrides, whether or not chemically defined (excl. compounds which are also carbides of heading 2849, and inorganic or organic compounds of mercury)
2015-01-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2015-01-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-01-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2015-01-0185429000Parts of electronic integrated circuits, n.e.s.
2014-12-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-12-0185429000Parts of electronic integrated circuits, n.e.s.
2014-11-0128500020Hydrides and nitrides, whether or not chemically defined (excl. compounds which are also carbides of heading 2849, and inorganic or organic compounds of mercury)
2014-11-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-11-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-11-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2014-11-0185429000Parts of electronic integrated circuits, n.e.s.
2014-10-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-10-0184869010Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays
2014-10-0185429000Parts of electronic integrated circuits, n.e.s.
2014-09-0128500020Hydrides and nitrides, whether or not chemically defined (excl. compounds which are also carbides of heading 2849, and inorganic or organic compounds of mercury)
2014-09-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-09-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-09-0185429000Parts of electronic integrated circuits, n.e.s.
2014-08-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-08-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2014-08-0185011010Synchronous motors of an output <= 18 W
2014-08-0185429000Parts of electronic integrated circuits, n.e.s.
2014-06-0128
2014-06-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-06-0185429000Parts of electronic integrated circuits, n.e.s.
2014-06-0190261089Instruments and apparatus for measuring or checking the flow or level of liquids, non-electronic (excl. flow meters, meters and regulators)
2014-04-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-04-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2014-04-0185411000Diodes (excl. photosensitive or light emitting diodes)
2014-04-0185423190Electronic integrated circuits as processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits (excl. in the form of multichip integrated circuits)
2014-04-0185429000Parts of electronic integrated circuits, n.e.s.
2014-03-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-03-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2014-02-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-02-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-01-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2014-01-0185429000Parts of electronic integrated circuits, n.e.s.
2013-12-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-12-0185429000Parts of electronic integrated circuits, n.e.s.
2013-11-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-11-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2013-10-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-10-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-10-0185429000Parts of electronic integrated circuits, n.e.s.
2013-10-0190258080Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic
2013-09-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-09-0190275000Instruments and apparatus for physical or chemical analysis, using UV, visible or IR optical radiations (excl. spectrometers, spectrophotometers, spectrographs, and gas or smoke analysis apparatus)
2013-08-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-07-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-07-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-07-0185429000Parts of electronic integrated circuits, n.e.s.
2013-07-0190258080Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic
2013-06-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-06-0185429000Parts of electronic integrated circuits, n.e.s.
2013-06-0190258080Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic
2013-05-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-05-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-05-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2013-05-0185429000Parts of electronic integrated circuits, n.e.s.
2013-04-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-04-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-04-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2013-04-0185415000Semiconductor devices, n.e.s.
2013-04-0185429000Parts of electronic integrated circuits, n.e.s.
2013-03-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-03-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2013-02-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-02-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2013-01-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-01-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2012-12-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-12-0190121010Electron microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles
2012-11-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-11-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-11-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2012-11-0185429000Parts of electronic integrated circuits, n.e.s.
2012-10-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-10-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-10-0184
2012-10-0185429000Parts of electronic integrated circuits, n.e.s.
2012-09-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-09-0185429000Parts of electronic integrated circuits, n.e.s.
2012-08-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-08-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2012-07-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-07-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-06-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-06-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2012-06-0185429000Parts of electronic integrated circuits, n.e.s.
2012-05-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-05-0184869030Parts of deflash machines for cleaning the metal leads of semiconductor packages prior to the electroplating process, n.e.s.
2012-05-0185411000Diodes (excl. photosensitive or light emitting diodes)
2012-04-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-04-0184879090Machinery parts of chapter 84, not intended for a specific purpose, n.e.s.
2012-04-0185429000Parts of electronic integrated circuits, n.e.s.
2012-03-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-02-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-02-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2012-01-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-01-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-12-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-12-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-12-0184861000Machines and apparatus for the manufacture of boules or wafers
2011-12-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2011-12-0185415000Semiconductor devices, n.e.s.
2011-12-0190318098Non-electronic and non-optical instruments, apparatus and machines for measuring or checking, n.e.s. in chapter 90
2011-11-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-11-0181129920Articles of hafnium "celtium" and germanium, n.e.s.
2011-11-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2011-10-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-10-0185411000Diodes (excl. photosensitive or light emitting diodes)
2011-09-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-09-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2011-08-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-07-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-07-0184869010Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays
2011-07-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2011-06-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-06-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2011-05-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-05-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2011-04-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-04-0184869010Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays
2011-04-0194054010Electric searchlights and spotlights (excl. for aircraft, motor vehicles or bicycles, and searchlight lamps)
2011-03-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-03-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2011-03-0185411000Diodes (excl. photosensitive or light emitting diodes)
2011-02-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-02-0185415000Semiconductor devices, n.e.s.
2011-02-0185423290Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash EĀ²PROMs)
2011-02-0185429000Parts of electronic integrated circuits, n.e.s.
2011-02-0190318098Non-electronic and non-optical instruments, apparatus and machines for measuring or checking, n.e.s. in chapter 90
2011-01-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-01-0184869010Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays
2010-12-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-12-0185411000Diodes (excl. photosensitive or light emitting diodes)
2010-12-0190275000Instruments and apparatus for physical or chemical analysis, using UV, visible or IR optical radiations (excl. spectrometers, spectrophotometers, spectrographs, and gas or smoke analysis apparatus)
2010-12-0194054010Electric searchlights and spotlights (excl. for aircraft, motor vehicles or bicycles, and searchlight lamps)
2010-11-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-10-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-10-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-10-0185415000Semiconductor devices, n.e.s.
2010-09-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-09-0184219900Parts of machinery and apparatus for filtering or purifying liquids or gases, n.e.s.
2010-09-0185415000Semiconductor devices, n.e.s.
2010-08-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-08-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-08-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-08-0190258080Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic
2010-07-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-07-0185415000Semiconductor devices, n.e.s.
2010-07-0190142080Instruments and appliances for aeronautical or space navigation (excl. inertial navigation systems, compasses and radio navigational equipment)
2010-07-0190309085Parts and accessories for instruments and apparatus for measuring or checking electrical quantities or for detecting ionising radiations, n.e.s. (excl. for instruments and apparatus for measuring or checking semiconductor wafers or devices)
2010-06-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-05-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-05-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-05-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-05-0184879090Machinery parts of chapter 84, not intended for a specific purpose, n.e.s.
2010-05-0185061011Manganese dioxide cells and batteries, alkaline, in the form of cylindrical cells (excl. spent)
2010-04-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-04-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-04-0185131000Portable electrical lamps designed to function by their own source of energy
2010-04-0185411000Diodes (excl. photosensitive or light emitting diodes)
2010-03-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-02-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-02-0182090020Inserts, indexable, for tools, unmounted, of sintered metal carbide or cermets
2010-02-0184139200Parts of liquid elevators, n.e.s.
2010-02-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-01-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-01-0185411000Diodes (excl. photosensitive or light emitting diodes)

For goods imported into the United Kingdom, only imports originating from outside the EU are shown

Government Grants / Awards
Technology Strategy Board Awards
IQE SILICON COMPOUNDS LIMITED has been awarded 2 awards from the Technology Strategy Board. The value of these awards is £ 251,991

CategoryAward Date Award/Grant
Ultra High Efficiency Solar Cells Using SiGeSn (HESCUS) : Feasibility Study 2014-01-01 £ 129,490
ENIAC - E2SG : European 2012-04-01 £ 122,501

How is this useful? The company may be investing in new products to generate new revenue streams or investing in new technologies to increase productivity / reduce costs. The company may own IPR as a result.

European Union CORDIS Awards
IQE SILICON COMPOUNDS LIMITED has been awarded 1 awards from the European Union under the FP7 Cordis research awards. The value of these awards is € 184,200

CategoryAward Date Award/Grant
Microsystems and Smart Miniaturised Systems : 2010-01-01 € 184,200

How is this useful? The company may be investing in new products to generate new revenue streams or investing in new technologies to increase productivity / reduce costs. The company may own IPR as a result.

Ownership
    We could not find any group structure information
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