Company Information for IQE SILICON COMPOUNDS LIMITED
BEECH HOUSE PASCAL CLOSE, ST MELLONS, CARDIFF, SOUTH GLAMORGAN, CF3 0LW,
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Company Registration Number
![]() Private Limited Company
Active |
Company Name | |
---|---|
IQE SILICON COMPOUNDS LIMITED | |
Legal Registered Office | |
BEECH HOUSE PASCAL CLOSE ST MELLONS CARDIFF SOUTH GLAMORGAN CF3 0LW Other companies in CF3 | |
Company Number | 03986643 | |
---|---|---|
Company ID Number | 03986643 | |
Date formed | 2000-05-05 | |
Country | ||
Origin Country | United Kingdom | |
Type | Private Limited Company | |
CompanyStatus | Active | |
Lastest accounts | 31/12/2023 | |
Account next due | 30/09/2025 | |
Latest return | 05/05/2016 | |
Return next due | 02/06/2017 | |
Type of accounts | AUDIT EXEMPTION SUBSIDIARY | |
VAT Number /Sales tax ID | GB771290625 |
Last Datalog update: | 2024-11-05 13:24:48 |
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Officer | Role | Date Appointed |
---|---|---|
JASON MARK HOWELLS |
||
ANDREW WILLIAM NELSON |
Officer | Role | Date Appointed | Date Resigned |
---|---|---|---|
PHILLIP JOHN RASMUSSEN |
Company Secretary | ||
JAMES LESLIE COVENTRY |
Company Secretary | ||
PHILLIP JOHN RASMUSSEN |
Director | ||
STEPHEN BYARS |
Director | ||
FILBUK (SECRETARIES) LIMITED |
Nominated Secretary | ||
FILBUK NOMINEES LIMITED |
Nominated Director |
Officer | Related Company | Role | Date Appointed | Role Status | Incorporation date | Company Status |
---|---|---|---|---|---|---|
COMPOUND SEMICONDUCTOR CENTRE LIMITED | Director | 2014-09-09 | CURRENT | 2014-09-09 | Active | |
LLANSANNOR MANAGEMENT CONSULTANTS LTD | Director | 2012-07-27 | CURRENT | 2012-07-27 | Active | |
OYSTER INNOVATIONS LIMITED | Director | 2012-04-17 | CURRENT | 2012-02-14 | Active | |
NANOGAN LIMITED | Director | 2009-10-07 | CURRENT | 2007-03-26 | Active | |
LLANSANNOR HOUSE HOLDINGS LIMITED | Director | 2009-03-23 | CURRENT | 2009-03-23 | Active | |
TRUELUX GROUP LIMITED | Director | 2009-03-23 | CURRENT | 2009-03-23 | Active | |
WAFER TECHNOLOGY INTERNATIONAL LIMITED | Director | 2000-11-22 | CURRENT | 1994-05-12 | Active | |
WAFER TECHNOLOGY LIMITED | Director | 2000-11-22 | CURRENT | 1984-07-03 | Active | |
IQE PLC | Director | 1999-04-13 | CURRENT | 1999-04-01 | Active | |
EPI HOLDINGS LIMITED | Director | 1996-05-24 | CURRENT | 1996-03-11 | Active | |
IQE (EUROPE) LIMITED | Director | 1992-10-26 | CURRENT | 1987-03-09 | Active |
Date | Document Type | Document Description |
---|---|---|
APPOINTMENT TERMINATED, DIRECTOR AMERICO LEMOS | ||
Audit exemption statement of guarantee by parent company for period ending 31/12/23 | ||
Notice of agreement to exemption from audit of accounts for period ending 31/12/23 | ||
Consolidated accounts of parent company for subsidiary company period ending 31/12/23 | ||
Audit exemption subsidiary accounts made up to 2023-12-31 | ||
CONFIRMATION STATEMENT MADE ON 05/05/24, WITH NO UPDATES | ||
APPOINTMENT TERMINATED, DIRECTOR NEIL JOHN RUMMINGS | ||
DIRECTOR APPOINTED JUTTA MEIER | ||
Audit exemption statement of guarantee by parent company for period ending 31/12/22 | ||
Notice of agreement to exemption from audit of accounts for period ending 31/12/22 | ||
Consolidated accounts of parent company for subsidiary company period ending 31/12/22 | ||
Audit exemption subsidiary accounts made up to 2022-12-31 | ||
DIRECTOR APPOINTED MR NEIL JOHN RUMMINGS | ||
APPOINTMENT TERMINATED, DIRECTOR TIMOTHY NEIL PULLEN | ||
Notice of agreement to exemption from audit of accounts for period ending 31/12/21 | ||
Audit exemption statement of guarantee by parent company for period ending 31/12/21 | ||
Consolidated accounts of parent company for subsidiary company period ending 31/12/21 | ||
Audit exemption subsidiary accounts made up to 2021-12-31 | ||
DIRECTOR APPOINTED MR AMERICO LEMOS | ||
PARENT_ACC | Consolidated accounts of parent company for subsidiary company period ending 31/12/19 | |
AGREEMENT2 | Notice of agreement to exemption from audit of accounts for period ending 31/12/19 | |
GUARANTEE2 | Audit exemption statement of guarantee by parent company for period ending 31/12/19 | |
CS01 | CONFIRMATION STATEMENT MADE ON 05/05/20, WITH UPDATES | |
CH01 | Director's details changed for Dr Andrew William Nelson on 2009-10-01 | |
AP03 | Appointment of Mr Thomas Andrew Dale as company secretary on 2020-03-19 | |
TM02 | Termination of appointment of Jason Mark Howells on 2019-12-20 | |
MR01 | REGISTRATION OF A CHARGE / CHARGE CODE 039866430011 | |
PARENT_ACC | Consolidated accounts of parent company for subsidiary company period ending 31/12/18 | |
AGREEMENT2 | Notice of agreement to exemption from audit of accounts for period ending 31/12/18 | |
TM01 | APPOINTMENT TERMINATED, DIRECTOR GODFREY HOWARD HARRISON AINSWORTH | |
CS01 | CONFIRMATION STATEMENT MADE ON 05/05/19, WITH NO UPDATES | |
AP01 | DIRECTOR APPOINTED MR TIMOTHY NEIL PULLEN | |
GUARANTEE2 | Audit exemption statement of guarantee by parent company for period ending 31/12/18 | |
MEM/ARTS | ARTICLES OF ASSOCIATION | |
RES13 | Resolutions passed:
| |
PSC05 | Change of details for Iqe Plc as a person with significant control on 2016-04-06 | |
RES13 | Resolutions passed:
| |
MR01 | REGISTRATION OF A CHARGE / CHARGE CODE 039866430010 | |
PARENT_ACC | Consolidated accounts of parent company for subsidiary company period ending 31/12/17 | |
AGREEMENT2 | Notice of agreement to exemption from audit of accounts for period ending 31/12/17 | |
AP01 | DIRECTOR APPOINTED DR GODFREY HOWARD HARRISON AINSWORTH | |
CS01 | CONFIRMATION STATEMENT MADE ON 05/05/18, WITH NO UPDATES | |
GUARANTEE2 | Audit exemption statement of guarantee by parent company for period ending 31/12/17 | |
TM02 | Termination of appointment of Phillip John Rasmussen on 2018-04-01 | |
AGREEMENT2 | Notice of agreement to exemption from audit of accounts for period ending 31/12/16 | |
PARENT_ACC | Consolidated accounts of parent company for subsidiary company period ending 31/12/16 | |
AP03 | Appointment of Mr Jason Mark Howells as company secretary on 2017-07-20 | |
LATEST SOC | 09/05/17 STATEMENT OF CAPITAL;GBP 2 | |
CS01 | CONFIRMATION STATEMENT MADE ON 05/05/17, WITH UPDATES | |
GUARANTEE2 | Audit exemption statement of guarantee by parent company for period ending 31/12/16 | |
PARENT_ACC | Consolidated accounts of parent company for subsidiary company period ending 31/12/15 | |
AGREEMENT2 | Notice of agreement to exemption from audit of accounts for period ending 31/12/15 | |
LATEST SOC | 05/05/16 STATEMENT OF CAPITAL;GBP 2 | |
AR01 | 05/05/16 ANNUAL RETURN FULL LIST | |
GUARANTEE2 | Audit exemption statement of guarantee by parent company for period ending 31/12/15 | |
PARENT_ACC | Consolidated accounts of parent company for subsidiary company period ending 31/12/14 | |
AGREEMENT2 | Notice of agreement to exemption from audit of accounts for period ending 31/12/14 | |
MR05 | STATEMENT OF RELEASE / CEASE FROM CHARGE / PART RELEASE / CHARGE NO 7 | |
MR01 | REGISTRATION OF A CHARGE / CHARGE CODE 039866430008 | |
LATEST SOC | 22/05/15 STATEMENT OF CAPITAL;GBP 2 | |
AR01 | 05/05/15 FULL LIST | |
GUARANTEE2 | AUDIT EXEMPTION STATEMENT OF GUARANTEE BY PARENT COMPANY FOR PERIOD ENDING 31/12/14 | |
AA | AUDIT EXEMPTION SUBSIDIARY ACCOUNTS MADE UP TO 31/12/13 | |
PARENT_ACC | CONSOLIDATED ACCOUNTS OF PARENT COMPANY FOR SUBSIDIARY COMPANY PERIOD ENDING 31/12/13 | |
AGREEMENT2 | NOTICE OF AGREEMENT TO EXEMPTION FROM AUDIT OF ACCOUNTS FOR PERIOD ENDING 31/12/13 | |
LATEST SOC | 08/05/14 STATEMENT OF CAPITAL;GBP 2 | |
AR01 | 05/05/14 FULL LIST | |
GUARANTEE2 | AUDIT EXEMPTION STATEMENT OF GUARANTEE BY PARENT COMPANY FOR PERIOD ENDING 31/12/13 | |
AA | FULL ACCOUNTS MADE UP TO 31/12/12 | |
AR01 | 05/05/13 FULL LIST | |
AA | FULL ACCOUNTS MADE UP TO 31/12/11 | |
AR01 | 05/05/12 FULL LIST | |
MG02 | DECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 5 | |
MG02 | DECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 6 | |
AA | FULL ACCOUNTS MADE UP TO 31/12/10 | |
MG01 | PARTICULARS OF A MORTGAGE OR CHARGE / CHARGE NO: 7 | |
AR01 | 05/05/11 FULL LIST | |
AA | FULL ACCOUNTS MADE UP TO 31/12/09 | |
AR01 | 05/05/10 FULL LIST | |
AA | FULL ACCOUNTS MADE UP TO 31/12/08 | |
363a | RETURN MADE UP TO 05/05/09; FULL LIST OF MEMBERS | |
288a | SECRETARY APPOINTED MR PHILLIP JOHN RASMUSSEN | |
288b | APPOINTMENT TERMINATED SECRETARY JAMES COVENTRY | |
AA | FULL ACCOUNTS MADE UP TO 31/12/07 | |
288b | APPOINTMENT TERMINATED DIRECTOR PHILLIP RASMUSSEN | |
363a | RETURN MADE UP TO 05/05/08; FULL LIST OF MEMBERS | |
190 | LOCATION OF DEBENTURE REGISTER | |
353 | LOCATION OF REGISTER OF MEMBERS | |
287 | REGISTERED OFFICE CHANGED ON 07/05/2008 FROM BEECH HOUSE CYPRESS DRIVE ST. MELLONS CARDIFF CF3 0LW | |
403a | DECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 4 | |
395 | PARTICULARS OF MORTGAGE/CHARGE | |
395 | PARTICULARS OF MORTGAGE/CHARGE | |
288a | NEW DIRECTOR APPOINTED | |
403a | DECLARATION OF SATISFACTION OF MORTGAGE/CHARGE | |
403a | DECLARATION OF SATISFACTION OF MORTGAGE/CHARGE | |
403a | DECLARATION OF SATISFACTION OF MORTGAGE/CHARGE | |
AA | FULL ACCOUNTS MADE UP TO 31/12/06 | |
363(190) | LOCATION OF DEBENTURE REGISTER ADDRESS CHANGED | |
363s | RETURN MADE UP TO 05/05/07; NO CHANGE OF MEMBERS | |
AA | FULL ACCOUNTS MADE UP TO 31/12/05 | |
363s | RETURN MADE UP TO 05/05/06; FULL LIST OF MEMBERS | |
395 | PARTICULARS OF MORTGAGE/CHARGE | |
AA | FULL ACCOUNTS MADE UP TO 31/12/04 | |
363s | RETURN MADE UP TO 05/05/05; FULL LIST OF MEMBERS | |
AA | FULL ACCOUNTS MADE UP TO 31/12/03 | |
363(288) | DIRECTOR'S PARTICULARS CHANGED | |
363s | RETURN MADE UP TO 05/05/04; FULL LIST OF MEMBERS | |
AA | FULL ACCOUNTS MADE UP TO 31/12/02 | |
363s | RETURN MADE UP TO 05/05/03; FULL LIST OF MEMBERS | |
288b | DIRECTOR RESIGNED | |
AA | FULL ACCOUNTS MADE UP TO 31/12/01 | |
363(288) | DIRECTOR'S PARTICULARS CHANGED | |
363s | RETURN MADE UP TO 05/05/02; FULL LIST OF MEMBERS | |
395 | PARTICULARS OF MORTGAGE/CHARGE | |
AA | FULL ACCOUNTS MADE UP TO 31/12/00 | |
363s | RETURN MADE UP TO 05/05/01; FULL LIST OF MEMBERS | |
225 | ACC. REF. DATE SHORTENED FROM 31/05/01 TO 31/12/00 | |
287 | REGISTERED OFFICE CHANGED ON 17/01/01 FROM: FITZALAN HOUSE FITZALAN ROAD CARDIFF SOUTH GLAMORGAN CF24 0EE | |
288b | SECRETARY RESIGNED | |
288b | DIRECTOR RESIGNED | |
288a | NEW SECRETARY APPOINTED | |
288a | NEW DIRECTOR APPOINTED | |
288a | NEW DIRECTOR APPOINTED | |
395 | PARTICULARS OF MORTGAGE/CHARGE | |
395 | PARTICULARS OF MORTGAGE/CHARGE | |
MEM/ARTS | MEMORANDUM OF ASSOCIATION ARTICLES OF ASSOCIATION |
Total # Mortgages/Charges | 11 |
---|---|
Mortgages/Charges outstanding | 5 |
Mortgages Partially Satisifed | 0 |
Mortgages Satisfied/Paid | 6 |
Charge Type | Date of Charge | Charge Status | Mortgagee |
---|---|---|---|
Outstanding | HSBC BANK PLC | ||
DEBENTURE | PART of the property or undertaking has been released from charge | HSBC BANK PLC | |
DEBENTURE | Satisfied | LLOYDS TSB BANK PLC | |
OMNIBUS GUARANTEE AND SET-OFF AGREEMENT | Satisfied | LLOYDS TSB BANK PLC | |
GUARANTEE & DEBENTURE | Satisfied | BARCLAYS BANK PLC | |
EQUIPMENT MORTGAGE | Satisfied | ING LEASE (UK) LIMITED | |
EQUIPMENT MORTGAGE | Satisfied | ING LEASE (UK) LTD | |
EQUIPMENT MORTGAGE | Satisfied | ING LEASE (UK) LIMITED |
The top companies supplying to UK government with the same SIC code (26110 - Manufacture of electronic components) as IQE SILICON COMPOUNDS LIMITED are:
Origin | Destination | Date | Import Code | Imported Goods classification description |
---|---|---|---|---|
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 85415000 | Semiconductor devices, n.e.s. | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 90258080 | Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 90258080 | Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic | ||
![]() | 90308200 | Instruments and apparatus for measuring or checking semiconductor wafers or devices | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 28500020 | Hydrides and nitrides, whether or not chemically defined (excl. compounds which are also carbides of heading 2849, and inorganic or organic compounds of mercury) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 28500020 | Hydrides and nitrides, whether or not chemically defined (excl. compounds which are also carbides of heading 2849, and inorganic or organic compounds of mercury) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869010 | Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 28500020 | Hydrides and nitrides, whether or not chemically defined (excl. compounds which are also carbides of heading 2849, and inorganic or organic compounds of mercury) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85011010 | Synchronous motors of an output <= 18 W | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 28 | |||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 90261089 | Instruments and apparatus for measuring or checking the flow or level of liquids, non-electronic (excl. flow meters, meters and regulators) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85411000 | Diodes (excl. photosensitive or light emitting diodes) | ||
![]() | 85423190 | Electronic integrated circuits as processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits (excl. in the form of multichip integrated circuits) | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 90258080 | Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 90275000 | Instruments and apparatus for physical or chemical analysis, using UV, visible or IR optical radiations (excl. spectrometers, spectrophotometers, spectrographs, and gas or smoke analysis apparatus) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 90258080 | Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 90258080 | Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85415000 | Semiconductor devices, n.e.s. | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 90121010 | Electron microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 84 | |||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869030 | Parts of deflash machines for cleaning the metal leads of semiconductor packages prior to the electroplating process, n.e.s. | ||
![]() | 85411000 | Diodes (excl. photosensitive or light emitting diodes) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84879090 | Machinery parts of chapter 84, not intended for a specific purpose, n.e.s. | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 84861000 | Machines and apparatus for the manufacture of boules or wafers | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85415000 | Semiconductor devices, n.e.s. | ||
![]() | 90318098 | Non-electronic and non-optical instruments, apparatus and machines for measuring or checking, n.e.s. in chapter 90 | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 81129920 | Articles of hafnium "celtium" and germanium, n.e.s. | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 85411000 | Diodes (excl. photosensitive or light emitting diodes) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869010 | Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869010 | Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays | ||
![]() | 94054010 | Electric searchlights and spotlights (excl. for aircraft, motor vehicles or bicycles, and searchlight lamps) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 85411000 | Diodes (excl. photosensitive or light emitting diodes) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 85415000 | Semiconductor devices, n.e.s. | ||
![]() | 85423290 | Memories in multicombinational forms such as stack D-RAMs and modules (excl. in the form of multichip integrated circuits, and D-RAMs, S-Rams, cache-RAMs, EPROMs and flash EĀ²PROMs) | ||
![]() | 85429000 | Parts of electronic integrated circuits, n.e.s. | ||
![]() | 90318098 | Non-electronic and non-optical instruments, apparatus and machines for measuring or checking, n.e.s. in chapter 90 | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84869010 | Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 85411000 | Diodes (excl. photosensitive or light emitting diodes) | ||
![]() | 90275000 | Instruments and apparatus for physical or chemical analysis, using UV, visible or IR optical radiations (excl. spectrometers, spectrophotometers, spectrographs, and gas or smoke analysis apparatus) | ||
![]() | 94054010 | Electric searchlights and spotlights (excl. for aircraft, motor vehicles or bicycles, and searchlight lamps) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 85415000 | Semiconductor devices, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 84219900 | Parts of machinery and apparatus for filtering or purifying liquids or gases, n.e.s. | ||
![]() | 85415000 | Semiconductor devices, n.e.s. | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 90258080 | Hydrometers, areometers and similar floating instruments, hygrometers and psychrometers, whether or not combined with each other or with thermometers or barometers, non-electronic | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 85415000 | Semiconductor devices, n.e.s. | ||
![]() | 90142080 | Instruments and appliances for aeronautical or space navigation (excl. inertial navigation systems, compasses and radio navigational equipment) | ||
![]() | 90309085 | Parts and accessories for instruments and apparatus for measuring or checking electrical quantities or for detecting ionising radiations, n.e.s. (excl. for instruments and apparatus for measuring or checking semiconductor wafers or devices) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 84879090 | Machinery parts of chapter 84, not intended for a specific purpose, n.e.s. | ||
![]() | 85061011 | Manganese dioxide cells and batteries, alkaline, in the form of cylindrical cells (excl. spent) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 85131000 | Portable electrical lamps designed to function by their own source of energy | ||
![]() | 85411000 | Diodes (excl. photosensitive or light emitting diodes) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 82090020 | Inserts, indexable, for tools, unmounted, of sintered metal carbide or cermets | ||
![]() | 84139200 | Parts of liquid elevators, n.e.s. | ||
![]() | 84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | ||
![]() | 38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | ||
![]() | 85411000 | Diodes (excl. photosensitive or light emitting diodes) |
For goods imported into the United Kingdom, only imports originating from outside the EU are shown
Category | Award/Grant | |
---|---|---|
Ultra High Efficiency Solar Cells Using SiGeSn (HESCUS) : Feasibility Study | 2014-01-01 | £ 129,490 |
ENIAC - E2SG : European | 2012-04-01 | £ 122,501 |
How is this useful? The company may be investing in new products to generate new revenue streams or investing in new technologies to increase productivity / reduce costs. The company may own IPR as a result.
Category | Award/Grant | |
---|---|---|
Microsystems and Smart Miniaturised Systems : | 2010-01-01 | € 184,200 |
How is this useful? The company may be investing in new products to generate new revenue streams or investing in new technologies to increase productivity / reduce costs. The company may own IPR as a result.
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