Cookie Consent by FreePrivacyPolicy.com
Datalog Logo
Free data on 57M+ companies
Home > England & Wales Companies > IQE PLC
Company Information for

IQE PLC

PASCAL CLOSE, ST MELLONS, CARDIFF, SOUTH GLAMORGAN, CF3 0LW,
Company Registration Number
03745726
Public Limited Company
Active

Company Overview

About Iqe Plc
IQE PLC was founded on 1999-04-01 and has its registered office in Cardiff. The organisation's status is listed as "Active". Iqe Plc is a Public Limited Company registered in with Companies House and the accounts submission requirement is categorised as GROUP
  • Group companies must submit full accounts if any company is a PLC (Public Limited Company)
  • Financial services firms: authorised insurance company, a banking company, an e-money issuer, a MiFID investment firm or a UCITS management company must submit full accounts even if they qualify as small
  • The combined turnover of the group must be < £6.5M, balance sheet <£3.26M and employ less than 50 people to not submit full accounts
Key Data
Company Name
IQE PLC
 
Legal Registered Office
PASCAL CLOSE
ST MELLONS
CARDIFF
SOUTH GLAMORGAN
CF3 0LW
Other companies in CF3
 
Telephone029 2083 9400
 
Filing Information
Company Number 03745726
Company ID Number 03745726
Date formed 1999-04-01
Country 
Origin Country United Kingdom
Type Public Limited Company
CompanyStatus Active
Lastest accounts 31/12/2022
Account next due 30/06/2024
Latest return 01/04/2016
Return next due 29/04/2017
Type of accounts GROUP
VAT Number /Sales tax ID GB736457608  
Last Datalog update: 2024-03-06 05:28:37
Primary Source:Companies House
There are multiple companies registered at this address, the registered address may be the accountant's offices for IQE PLC
Is this data useful to you?
If you found the data here useful, PLEASE HELP US. We are a start-up and believe in making information freely available. Please DONATE to help.
Alternatively by linking to us, posting on twitter, facebook and linkedin about us and generally spreading the word, you'll help us to grow. Our vision is to provide high quality data about the activities of all the companies in the world and where possible make it free to use and view. Finding and integrating data from thousands of data sources is time consuming and needs lots of effort. By simply spreading the word about us, you will help us.

Company Officers of IQE PLC

Current Directors
Officer Role Date Appointed
JASON MARK HOWELLS
Company Secretary 2017-03-15
GODFREY HOWARD HARRISON AINSWORTH
Director 1999-04-22
DAVID GRANT
Director 2012-09-18
DEREK WILLIAM JONES
Director 2017-11-29
ANDREW WILLIAM NELSON
Director 1999-04-13
PHILIP PATRICK SMITH
Director 2016-12-19
HOWARD ROBERT WILLIAMS
Director 2004-12-10
Previous Officers
Officer Role Date Appointed Date Resigned
PHILLIP JOHN RASMUSSEN
Director 2007-03-12 2018-04-01
SIMON JOHN GIBSON
Director 2002-01-01 2017-06-13
PHILLIP JOHN RASMUSSEN
Company Secretary 2009-01-19 2017-03-15
ADRIAN GILMOUR MELDRUM
Director 2010-06-29 2012-09-21
JAMES LESLIE COVENTRY
Company Secretary 1999-04-13 2009-01-16
STUART ANDREW HALL
Director 2004-12-10 2007-03-12
MICHAEL DARAK SCOTT
Director 1999-04-13 2006-05-31
MARTIN STEVEN MARK LAMB
Director 2000-11-22 2005-04-29
STEPHEN BYARS
Director 2001-01-01 2003-03-07
THOMAS HIERL
Director 1999-04-30 2003-03-07
RICHARD JOHN GEORGE CLARKE
Director 2001-03-08 2002-08-31
SCOTT MASSIE
Director 1999-04-30 2002-08-31
GLEN BRESSNER
Director 1999-04-30 2002-05-17
FILBUK (SECRETARIES) LIMITED
Company Secretary 1999-04-01 1999-04-14
FILBUK NOMINEES LIMITED
Director 1999-04-01 1999-04-14

Related Directorships

Officer Related Company Role Date Appointed Role StatusIncorporation dateCompany Status
GODFREY HOWARD HARRISON AINSWORTH EPI HOLDINGS LIMITED Director 2018-04-10 CURRENT 1996-03-11 Active
GODFREY HOWARD HARRISON AINSWORTH COMPOUND SEMICONDUCTOR CENTRE LIMITED Director 2018-04-09 CURRENT 2014-09-09 Active
GODFREY HOWARD HARRISON AINSWORTH NANOGAN LIMITED Director 2018-04-09 CURRENT 2007-03-26 Active
GODFREY HOWARD HARRISON AINSWORTH IQE (EUROPE) LIMITED Director 1997-06-20 CURRENT 1987-03-09 Active
ANDREW WILLIAM NELSON COMPOUND SEMICONDUCTOR CENTRE LIMITED Director 2014-09-09 CURRENT 2014-09-09 Active
ANDREW WILLIAM NELSON LLANSANNOR MANAGEMENT CONSULTANTS LTD Director 2012-07-27 CURRENT 2012-07-27 Active
ANDREW WILLIAM NELSON OYSTER INNOVATIONS LIMITED Director 2012-04-17 CURRENT 2012-02-14 Active
ANDREW WILLIAM NELSON NANOGAN LIMITED Director 2009-10-07 CURRENT 2007-03-26 Active
ANDREW WILLIAM NELSON LLANSANNOR HOUSE HOLDINGS LIMITED Director 2009-03-23 CURRENT 2009-03-23 Active
ANDREW WILLIAM NELSON TRUELUX GROUP LIMITED Director 2009-03-23 CURRENT 2009-03-23 Active
ANDREW WILLIAM NELSON IQE SILICON COMPOUNDS LIMITED Director 2000-12-01 CURRENT 2000-05-05 Active
ANDREW WILLIAM NELSON WAFER TECHNOLOGY INTERNATIONAL LIMITED Director 2000-11-22 CURRENT 1994-05-12 Active
ANDREW WILLIAM NELSON WAFER TECHNOLOGY LIMITED Director 2000-11-22 CURRENT 1984-07-03 Active
ANDREW WILLIAM NELSON EPI HOLDINGS LIMITED Director 1996-05-24 CURRENT 1996-03-11 Active
ANDREW WILLIAM NELSON IQE (EUROPE) LIMITED Director 1992-10-26 CURRENT 1987-03-09 Active
PHILIP PATRICK SMITH TECHSKILLS ORGANISATION Director 2018-03-13 CURRENT 2010-04-14 Active
PHILIP PATRICK SMITH BE THE BUSINESS TRADING LTD Director 2017-08-01 CURRENT 2017-08-01 Active
PHILIP PATRICK SMITH THE TECH PARTNERSHIP Director 2011-06-06 CURRENT 2000-06-16 Active - Proposal to Strike off
HOWARD ROBERT WILLIAMS COMPOUND SEMICONDUCTOR CENTRE LIMITED Director 2015-07-06 CURRENT 2014-09-09 Active
HOWARD ROBERT WILLIAMS IQE (EUROPE) LIMITED Director 1998-01-01 CURRENT 1987-03-09 Active

More director information

Corporation Filing History
Companies House Filing History
This is a record of the public documents (corporate filing) lodged from Companies House where the company has filed annual returns and other statutory filing documents. Examples of documents filed include: change of registered office, accounts filing, director/officer appointments & resignations, changes in share capital, shareholder members lists etc.

DateDocument TypeDocument Description
2024-02-13DIRECTOR APPOINTED JUTTA MEIER
2024-01-3129/01/24 STATEMENT OF CAPITAL GBP 9615536.92
2024-01-04DIRECTOR APPOINTED MARIA MARCED
2024-01-04DIRECTOR APPOINTED MR BAMDAD BASTANI
2024-01-04APPOINTMENT TERMINATED, DIRECTOR DEREK WILLIAM JONES
2023-10-0521/09/23 STATEMENT OF CAPITAL GBP 9615086.92
2023-09-1325/08/23 STATEMENT OF CAPITAL GBP 9614802.06
2023-07-3113/07/23 STATEMENT OF CAPITAL GBP 9614647.68
2023-07-18Resolutions passed:<ul><li>Resolution passed removal of pre-emption<li>Resolution on securities</ul>
2023-07-10DIRECTOR APPOINTED MR HARMESH KUMAR SUNIARA
2023-07-05GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/22
2023-06-3026/06/23 STATEMENT OF CAPITAL GBP 9613554.55
2023-06-2119/05/23 STATEMENT OF CAPITAL GBP 9612339.72
2023-06-13APPOINTMENT TERMINATED, DIRECTOR TIMOTHY NEIL PULLEN
2023-05-0227/04/23 STATEMENT OF CAPITAL GBP 8055184.63
2023-04-06CONFIRMATION STATEMENT MADE ON 01/04/23, WITH NO UPDATES
2023-03-3128/03/23 STATEMENT OF CAPITAL GBP 8052834.63
2023-02-2828/02/23 STATEMENT OF CAPITAL GBP 8049609.65
2023-01-3131/01/23 STATEMENT OF CAPITAL GBP 8048894.65
2023-01-0919/12/22 STATEMENT OF CAPITAL GBP 8048419.65
2022-09-3028/09/22 STATEMENT OF CAPITAL GBP 8047467.15
2022-09-0123/08/22 STATEMENT OF CAPITAL GBP 8046694.5
2022-08-01SH0107/07/22 STATEMENT OF CAPITAL GBP 8046342.99
2022-07-07RES10Resolutions passed:
  • Resolution of allotment of securities
  • Resolution of removal of pre-emption rights
2022-06-29SH0128/06/22 STATEMENT OF CAPITAL GBP 8045587.17
2022-06-20GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/21
2022-06-20AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/21
2022-05-31SH0127/05/22 STATEMENT OF CAPITAL GBP 8045562.17
2022-05-23SH0114/04/22 STATEMENT OF CAPITAL GBP 8044793.42
2022-04-06RP04SH01Second filing of capital allotment of shares GBP8,035,557.56
2022-04-04SH0125/03/22 STATEMENT OF CAPITAL GBP 8044333.42
2022-04-04CS01CONFIRMATION STATEMENT MADE ON 01/04/22, WITH NO UPDATES
2022-02-25SH0125/02/22 STATEMENT OF CAPITAL GBP 8042475.58
2022-02-0214/01/22 STATEMENT OF CAPITAL GBP 8041539.5
2022-02-02SH0114/01/22 STATEMENT OF CAPITAL GBP 8041539.5
2022-01-24DIRECTOR APPOINTED MR AMERICO LEMOS
2022-01-24AP01DIRECTOR APPOINTED MR AMERICO LEMOS
2021-12-3023/12/21 STATEMENT OF CAPITAL GBP 8035557.56
2021-12-30SH0123/12/21 STATEMENT OF CAPITAL GBP 8035557.56
2021-11-30SH0125/11/21 STATEMENT OF CAPITAL GBP 8033809.98
2021-11-01SH0128/10/21 STATEMENT OF CAPITAL GBP 8024397.43
2021-09-30SH0129/09/21 STATEMENT OF CAPITAL GBP 8022678.24
2021-09-20TM01APPOINTMENT TERMINATED, DIRECTOR DAVID GRANT
2021-09-16AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/20
2021-09-01SH0123/08/21 STATEMENT OF CAPITAL GBP 8022070.18
2021-08-05AP01DIRECTOR APPOINTED VICTORIA HULL
2021-07-29SH0119/07/21 STATEMENT OF CAPITAL GBP 8020473.11
2021-07-29MEM/ARTSARTICLES OF ASSOCIATION
2021-07-29RES10Resolutions passed:
  • Resolution of allotment of securities
  • Resolution of removal of pre-emption rights
  • Resolution of adoption of Articles of Association
2021-07-16SH0101/07/21 STATEMENT OF CAPITAL GBP 8020064.79
2021-06-30SH0118/06/21 STATEMENT OF CAPITAL GBP 8013194.79
2021-05-28SH0128/05/21 STATEMENT OF CAPITAL GBP 8012999.33
2021-05-11SH0129/04/21 STATEMENT OF CAPITAL GBP 8012936.84
2021-04-15CS01CONFIRMATION STATEMENT MADE ON 01/04/21, WITH NO UPDATES
2021-04-15CH01Director's details changed for Sir Derek William Jones on 2017-11-29
2021-04-12SH0131/03/21 STATEMENT OF CAPITAL GBP 8012414.89
2021-03-16AD03Registers moved to registered inspection location of Equiniti Limited Aspect House Spencer Road Lancing West Sussex BN99 6DA
2021-03-16AD02Register inspection address changed to Equiniti Limited Aspect House Spencer Road Lancing West Sussex BN99 6DA
2021-03-03SH0126/02/21 STATEMENT OF CAPITAL GBP 8011327.18
2021-02-12SH0129/01/21 STATEMENT OF CAPITAL GBP 8007900.79
2020-12-23SH0102/12/20 STATEMENT OF CAPITAL GBP 8002407.36
2020-12-17SH0104/11/20 STATEMENT OF CAPITAL GBP 8001873.33
2020-12-16RP04SH01Second filing of capital allotment of shares GBP7,972,827.98
2020-09-08SH0102/09/20 STATEMENT OF CAPITAL GBP 7972832.52
2020-08-10SH0105/08/20 STATEMENT OF CAPITAL GBP 7971329.51
2020-07-13SH0101/07/20 STATEMENT OF CAPITAL GBP 7970479.51
2020-07-08RP04AP01Second filing of director appointment of David Grant
2020-07-08AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/19
2020-07-06RES11Resolutions passed:
  • Resolution of removal of pre-emption rights
  • Resolution of allotment of securities
2020-06-04SH0103/06/20 STATEMENT OF CAPITAL GBP 7968158.87
2020-04-23SH0115/04/20 STATEMENT OF CAPITAL GBP 7964558.82
2020-04-16CS01CONFIRMATION STATEMENT MADE ON 01/04/20, WITH NO UPDATES
2020-04-16SH0103/02/20 STATEMENT OF CAPITAL GBP 7963534.79
2020-04-15SH0101/05/19 STATEMENT OF CAPITAL GBP 7831405.51
2020-03-23AP03Appointment of Mr Thomas Andrew Dale as company secretary on 2020-03-19
2020-03-23TM02Termination of appointment of Link Company Matters Limited on 2020-03-19
2019-12-23AP04Appointment of Link Company Matters Limited as company secretary on 2019-12-20
2019-12-23TM02Termination of appointment of Jason Mark Howells on 2019-12-20
2019-08-14TM01APPOINTMENT TERMINATED, DIRECTOR HOWARD ROBERT WILLIAMS
2019-07-08AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/18
2019-06-26TM01APPOINTMENT TERMINATED, DIRECTOR GODFREY HOWARD HARRISON AINSWORTH
2019-05-15AP01DIRECTOR APPOINTED ELLEN CAROL TREDWAY CHESNEY
2019-04-15CS01CONFIRMATION STATEMENT MADE ON 01/04/19, WITH UPDATES
2019-02-14AP01DIRECTOR APPOINTED MR TIMOTHY NEIL PULLEN
2019-02-04MR01REGISTRATION OF A CHARGE / CHARGE CODE 037457260015
2019-01-31MR01REGISTRATION OF A CHARGE / CHARGE CODE 037457260014
2019-01-30MR01REGISTRATION OF A CHARGE / CHARGE CODE 037457260013
2019-01-21MR04 STATEMENT OF SATISFACTION OF A CHARGE / FULL / CHARGE CODE 8
2018-11-07CH01Director's details changed for Mr Philip Patrick Smith on 2018-11-07
2018-06-26AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/17
2018-06-13RES10Resolutions passed:
  • Resolution of allotment of securities
2018-04-10LATEST SOC10/04/18 STATEMENT OF CAPITAL;GBP 7561517.46
2018-04-10CS01CONFIRMATION STATEMENT MADE ON 01/04/18, WITH UPDATES
2018-04-10TM01APPOINTMENT TERMINATED, DIRECTOR PHILLIP JOHN RASMUSSEN
2017-12-08LATEST SOC08/12/17 STATEMENT OF CAPITAL;GBP 7556708.2
2017-12-08SH0116/11/17 STATEMENT OF CAPITAL GBP 7556708.2
2017-12-01AP01DIRECTOR APPOINTED SIR DEREK WILLIAM JONES
2017-12-01CH01Director's details changed for Dr David Grant on 2017-12-01
2017-11-13MEM/ARTSARTICLES OF ASSOCIATION
2017-11-13RES01ADOPT ARTICLES 13/11/17
2017-08-07PSC08Notification of a person with significant control statement
2017-06-27AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/16
2017-06-15TM01APPOINTMENT TERMINATED, DIRECTOR SIMON JOHN GIBSON
2017-04-11LATEST SOC11/04/17 STATEMENT OF CAPITAL;GBP 6764855.54
2017-04-11CS01CONFIRMATION STATEMENT MADE ON 01/04/17, WITH UPDATES
2017-03-16TM02Termination of appointment of Phillip John Rasmussen on 2017-03-15
2017-03-16AP03Appointment of Mr Jason Mark Howells as company secretary on 2017-03-15
2017-01-24AP01DIRECTOR APPOINTED MR PHILIP PATRICK SMITH
2016-09-19MR01REGISTRATION OF A CHARGE / CHARGE CODE 037457260011
2016-05-23AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/15
2016-04-07LATEST SOC07/04/16 STATEMENT OF CAPITAL;GBP 6655331.7
2016-04-07AR0101/04/16 FULL LIST
2015-08-06MR01REGISTRATION OF A CHARGE / CHARGE CODE 037457260010
2015-07-16AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/14
2015-04-28LATEST SOC28/04/15 STATEMENT OF CAPITAL;GBP 6603277.67
2015-04-28AR0101/04/15 FULL LIST
2014-06-26AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/13
2014-05-08LATEST SOC08/05/14 STATEMENT OF CAPITAL;GBP 6475136.61
2014-05-08AR0101/04/14 FULL LIST
2013-11-01RES13RPTS RECEIVED, AUDS & OFFICERS RE-APP 22/05/2013
2013-11-01RES01ADOPT ARTICLES 22/05/2013
2013-09-30MEM/ARTSARTICLES OF ASSOCIATION
2013-07-08AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/12
2013-04-29AR0101/04/13 FULL LIST
2013-04-29CH01DIRECTOR'S CHANGE OF PARTICULARS / MR PHILLIP JOHN RASMUSSEN / 28/04/2013
2013-04-29CH01DIRECTOR'S CHANGE OF PARTICULARS / HOWARD ROBERT WILLIAMS / 28/04/2013
2013-04-29CH01DIRECTOR'S CHANGE OF PARTICULARS / MR ANDREW WILLIAM NELSON / 28/04/2013
2013-04-29CH01DIRECTOR'S CHANGE OF PARTICULARS / PROFESSOR SIMON JOHN GIBSON / 27/04/2013
2013-04-29CH01DIRECTOR'S CHANGE OF PARTICULARS / HOWARD ROBERT WILLIAMS / 28/04/2013
2013-04-29CH01DIRECTOR'S CHANGE OF PARTICULARS / MR PHILLIP JOHN RASMUSSEN / 28/04/2013
2013-04-29CH01DIRECTOR'S CHANGE OF PARTICULARS / MR ANDREW WILLIAM NELSON / 28/04/2013
2013-04-29CH01DIRECTOR'S CHANGE OF PARTICULARS / PROFESSOR SIMON JOHN GIBSON / 28/04/2013
2013-04-29CH03SECRETARY'S CHANGE OF PARTICULARS / MR PHILLIP JOHN RASMUSSEN / 28/04/2013
2013-04-29CH01DIRECTOR'S CHANGE OF PARTICULARS / DR GODFREY HOWARD HARRISON AINSWORTH / 28/04/2013
2013-02-11MG01DUPLICATE MORTGAGE CERTIFICATECHARGE NO:9
2013-01-30MG01PARTICULARS OF A MORTGAGE OR CHARGE / CHARGE NO: 9
2012-10-23AP01DIRECTOR APPOINTED DR DAVID GRANT
2012-10-23TM01APPOINTMENT TERMINATED, DIRECTOR ADRIAN MELDRUM
2012-07-19MG01PARTICULARS OF A MORTGAGE OR CHARGE / CHARGE NO: 8
2012-07-03AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/11
2012-04-03AR0101/04/12 NO MEMBER LIST
2011-10-26MG02DECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 6
2011-10-26MG02DECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 5
2011-07-04AR0101/04/11 BULK LIST
2011-07-04AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/10
2011-05-25MG01PARTICULARS OF A MORTGAGE OR CHARGE / CHARGE NO: 7
2010-08-11CH01DIRECTOR'S CHANGE OF PARTICULARS / DR GODFREY HOWARD HARRISON AINSWORTH / 10/08/2010
2010-07-27AP01DIRECTOR APPOINTED MR ADRIAN GILMOUR MELDRUM
2010-06-28AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/09
2010-06-07AR0101/04/10 BULK LIST
2010-02-19CH01DIRECTOR'S CHANGE OF PARTICULARS / DR GODFREY HOWARD HARRISON AINSWORTH / 09/11/2009
2010-02-19SH0131/01/10 STATEMENT OF CAPITAL GBP 4435006
2009-10-20SH0106/08/09 STATEMENT OF CAPITAL GBP 1647080.34
2009-10-20SH0130/06/09 STATEMENT OF CAPITAL GBP 1646940.24
2009-07-2488(2)AD 14/07/09 GBP SI 34809@0.01=348.09 GBP IC 4348119.13/4348467.22
2009-07-15AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/08
2009-07-08363aRETURN MADE UP TO 01/04/09; FULL LIST OF MEMBERS
2009-06-0888(2)AD 29/05/09 GBP SI 1140824@0.01=11408.24 GBP IC 4336710.89/4348119.13
2009-06-03353LOCATION OF REGISTER OF MEMBERS
2009-06-0388(2)AD 01/05/09 GBP SI 61450@0.01=614.5 GBP IC 4336096.39/4336710.89
2009-06-0388(2)AD 03/04/09 GBP SI 276871@0.01=2768.71 GBP IC 4333327.68/4336096.39
2009-06-0388(2)AD 06/04/09 GBP SI 69307@0.01=693.07 GBP IC 4332634.61/4333327.68
2009-03-31288aSECRETARY APPOINTED MR PHILLIP JOHN RASMUSSEN
2009-03-23288bAPPOINTMENT TERMINATED SECRETARY JAMES COVENTRY
2008-12-1888(2)AD 25/11/08 GBP SI 6320@0.01=63.2 GBP IC 4332571.41/4332634.61
2008-11-14OC138REDUCTION OF ISS CAPITAL AND MINUTE (OC)
2008-11-14CERT21REDUCTION OF SHARE PREMIUM
2008-11-14OC138REDUCTION OF ISS CAPITAL AND MINUTE (OC)
2008-10-2088(2)AD 02/10/08 GBP SI 54496@0.01=544.96 GBP IC 4332026.45/4332571.41
2008-10-2088(2)AD 08/10/08 GBP SI 172550@0.01=1725.5 GBP IC 4330300.95/4332026.45
2008-09-2688(2)AD 09/09/08 GBP SI 592772@0.01=5927.72 GBP IC 4324373.23/4330300.95
2008-07-25AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/07
2008-07-25RES13OPTION SCHEME BE ALTERED, PREMIUM ACCOUNT RESOLUTION BE CANCELLED 21/07/2008
2008-07-25RES10AUTHORISED ALLOTMENT OF SHARES AND DEBENTURES
2008-04-16403aDECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 4
2008-04-16403aDECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 3
2008-04-15363(190)LOCATION OF DEBENTURE REGISTER ADDRESS CHANGED
2008-04-15363sRETURN MADE UP TO 01/04/08; BULK LIST AVAILABLE SEPARATELY
2008-02-01395PARTICULARS OF MORTGAGE/CHARGE
2008-01-29395PARTICULARS OF MORTGAGE/CHARGE
2007-11-06287REGISTERED OFFICE CHANGED ON 06/11/07 FROM: PASCAL CLOSE, ST.MELLONS, CARDIFF, GLAMORGAN CF3 0LW
2007-08-14RES11DISAPPLICATION OF PRE-EMPTION RIGHTS
2007-08-14RES10AUTHORISED ALLOTMENT OF SHARES AND DEBENTURES
2007-07-16AAGROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/06
2007-04-19363(190)LOCATION OF DEBENTURE REGISTER ADDRESS CHANGED
2007-04-19363sRETURN MADE UP TO 01/04/07; BULK LIST AVAILABLE SEPARATELY
2007-03-27288bDIRECTOR RESIGNED
2007-03-27288aNEW DIRECTOR APPOINTED
2006-08-31123NC INC ALREADY ADJUSTED 15/08/06
2006-08-30RES10AUTHORISED ALLOTMENT OF SHARES AND DEBENTURES
2006-08-30RES04£ NC 5000000/6500000 31/0
Industry Information
SIC/NAIC Codes
70 - Activities of head offices; management consultancy activities
701 - Activities of head offices
70100 - Activities of head offices




Licences & Regulatory approval
We could not find any licences issued to IQE PLC or authorisation from an industry specific regulator to operate. These may not be required.
Share this page on Facebook
Risks
Legal Notices
No legal notices or events such as winding-up orders or proposals to strike-off have been issued
Fines / Sanctions
No fines or sanctions have been issued against IQE PLC
Liabilities
Mortgages / Charges
Total # Mortgages/Charges 17
Mortgages/Charges outstanding 10
Mortgages Partially Satisifed 0
Mortgages Satisfied/Paid 7
Details of Mortgagee Charges
Charge Type Date of Charge Charge Status Mortgagee
2016-09-12 Outstanding HSBC BANK PLC
2015-08-01 Outstanding HSBC BANK PLC
PLEDGE AGREEMENT 2013-01-30 Outstanding HSBC BANK PLC (THE COLLATERAL AGENT)
MASTER SECURITY AGREEMENT 2012-07-19 Outstanding RBS ASSET FINANCE INC
DEBENTURE 2011-05-25 Outstanding HSBC BANK PLC
DEBENTURE 2008-01-24 Satisfied LLOYDS TSB BANK PLC
OMNIBUS GUARANTEE AND SET-OFF AGREEMENT 2008-01-24 Satisfied LLOYDS TSB BANK PLC
GUARANTEE & DEBENTURE 2005-11-07 Satisfied BARCLAYS BANK PLC
DEED OF CHARGE OVER CREDIT BALANCES 2001-03-28 Satisfied BARCLAYS BANK PLC
DEED OF CHARGE OVER CREDIT BALANCES 2001-02-16 Satisfied BARCLAYS BANK PLC
DEED OF CHARGE OVER CREDIT BALANCES 2000-11-22 Satisfied BARCLAYS BANK PLC
Intangible Assets
Patents
We have not found any records of IQE PLC registering or being granted any patents
Domain Names
We could not find the registrant information for the domain
Trademarks

Trademark applications by IQE PLC

IQE PLC is the Original Applicant for the trademark IQE ™ (79163060) through the USPTO on the 2014-07-03
Electronic components, namely, wafers; semiconductor wafers; wafers for integrated circuits; silicon wafers; epitaxial wafers; compound semiconductor wafers; gallium arsenide based wafers; indium phosphide based wafers; gallium nitride based wafers; gallium antimonide based wafers; indium antimonide based wafers
IQE PLC is the Owner at publication for the trademark CREV ™ (88301201) through the USPTO on the 2019-02-14
Semiconductor substrates, namely, wafers having one or more layers with semiconductor properties
IQE PLC is the Owner at publication for the trademark CREV ™ (88301201) through the USPTO on the 2019-02-14
Semiconductor substrates, namely, wafers having one or more layers with semiconductor properties
IQE PLC is the Owner at publication for the trademark CREV ™ (88301201) through the USPTO on the 2019-02-14
Semiconductor substrates, namely, wafers having one or more layers with semiconductor properties
IQE PLC is the Owner at publication for the trademark CREV ™ (88301201) through the USPTO on the 2019-02-14
Semiconductor substrates, namely, wafers having one or more layers with semiconductor properties
Income
Government Income
We have not found government income sources for IQE PLC. This could be because the transaction value was below £ 500 with local government or below £ 25,000 for central government. We have found 8,000 supplier to government that are UK companies so approx 0.2% of companies listed on Datalog supply to government.

The top companies supplying to UK government with the same SIC code (70100 - Activities of head offices) as IQE PLC are:

VEOLIA ENVIRONMENTAL SERVICES GROUP (UK) LIMITED £ 58,274,118
SERCO LIMITED £ 39,871,694
MORGAN UTILITIES GROUP LIMITED £ 25,495,153
GO SOUTH COAST LIMITED £ 20,243,013
KIER SERVICES LIMITED £ 9,779,001
AON GLOBAL LIMITED £ 9,370,167
NORWEST HOLST CONSTRUCTION LIMITED £ 8,321,190
SSE PLC £ 5,909,870
SCOTTISH POWER UK PLC £ 2,553,785
SSE CONTRACTING GROUP LIMITED £ 1,985,346
SERCO LIMITED £ 651,949,621
NORTHAMPTON SCHOOLS LIMITED £ 165,146,062
VEOLIA ENVIRONMENTAL SERVICES GROUP (UK) LIMITED £ 122,287,107
CORONA ENERGY LIMITED £ 114,276,966
BABCOCK DYNCORP LIMITED £ 99,062,567
BUPA CARE SERVICES LIMITED £ 94,482,493
EQUANS REGENERATION LIMITED £ 88,705,184
GO SOUTH COAST LIMITED £ 81,092,122
KIER SERVICES LIMITED £ 74,827,163
CAMBRIDGESHIRE LEARNING AND COMMUNITY PARTNERSHIPS LIMITED £ 74,337,596
SERCO LIMITED £ 651,949,621
NORTHAMPTON SCHOOLS LIMITED £ 165,146,062
VEOLIA ENVIRONMENTAL SERVICES GROUP (UK) LIMITED £ 122,287,107
CORONA ENERGY LIMITED £ 114,276,966
BABCOCK DYNCORP LIMITED £ 99,062,567
BUPA CARE SERVICES LIMITED £ 94,482,493
EQUANS REGENERATION LIMITED £ 88,705,184
GO SOUTH COAST LIMITED £ 81,092,122
KIER SERVICES LIMITED £ 74,827,163
CAMBRIDGESHIRE LEARNING AND COMMUNITY PARTNERSHIPS LIMITED £ 74,337,596
SERCO LIMITED £ 651,949,621
NORTHAMPTON SCHOOLS LIMITED £ 165,146,062
VEOLIA ENVIRONMENTAL SERVICES GROUP (UK) LIMITED £ 122,287,107
CORONA ENERGY LIMITED £ 114,276,966
BABCOCK DYNCORP LIMITED £ 99,062,567
BUPA CARE SERVICES LIMITED £ 94,482,493
EQUANS REGENERATION LIMITED £ 88,705,184
GO SOUTH COAST LIMITED £ 81,092,122
KIER SERVICES LIMITED £ 74,827,163
CAMBRIDGESHIRE LEARNING AND COMMUNITY PARTNERSHIPS LIMITED £ 74,337,596
Outgoings
Business Rates/Property Tax
No properties were found where IQE PLC is liable for the business rates / property tax. This could be for a number of reasons.
  • The council hasnt published the data
  • We havent found or been able to process the councils data
  • The company is part of a group of companies and another company in the group is liable for business rates
  • The registered office may be a residential address which does not have a commercial designation. If the business is run from home then it won't be a commercial property and hence won't be liable for business rates.
  • Serviced offices are increasingly popular and therefore a business may not be paying business rates directly - the building owner is and this is incorporated in the office rental charge.
Import/Export of Goods
Goods imported/exported by IQE PLC
OriginDestinationDateImport CodeImported Goods classification description
2018-12-0038011000Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite)
2018-12-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-12-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-11-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-11-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-11-0068151090Articles of graphite or other carbon, for non-electrical purposes (excl. carbon fibres and articles of carbon fibres)
2018-10-0038011000Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite)
2018-10-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-10-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-10-0038190000Hydraulic brake fluids and other prepared liquids for hydraulic transmission not containing petroleum oil or bituminous mineral oil, or containing < 70% petroleum oil or bituminous mineral oil by weight
2018-09-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-09-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-09-0084869000
2018-09-0085369001Prefabricated elements for electrical circuits, for a voltage of <= 1.000 V
2018-09-0085369095
2018-08-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-08-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-07-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-07-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-06-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-06-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-06-0085340090Printed circuits consisting of conductor elements, contacts and other passive elements (excl. those with passive and active elements)
2018-06-0085369095
2018-05-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-05-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-05-0090271010Electronic gas or smoke analysis apparatus
2018-04-0038
2018-04-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-04-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-03-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-03-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-02-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-02-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-01-0038011000Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite)
2018-01-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2018-01-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2018-01-0070200005Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor materials
2018-01-0084799070
2018-01-0085340090Printed circuits consisting of conductor elements, contacts and other passive elements (excl. those with passive and active elements)
2018-01-0085369095
2017-04-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2017-04-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2017-03-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2017-03-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2017-03-0084111100Turbojets of a thrust <= 25 kN
2017-03-0090181100Electro-cardiographs
2017-02-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2017-02-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2017-01-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2017-01-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2017-01-0068151010Carbon fibres and articles of carbon fibres, for non-electrical purposes
2016-11-0038011000Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite)
2016-11-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-11-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2016-11-0073181590Screws and bolts, of iron or steel "whether or not with their nuts and washers", with heads (excl. slotted and cross-recessed screws and bolts, hexagon head screws and bolts; wood screws, self-tapping screws and screws and bolts for fixing railway track construction material, screw hooks, screw rings and lag screws)
2016-11-0081029900Articles of molybdenum, n.e.s.
2016-11-0084869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2016-11-0039231000Boxes, cases, crates and similar articles for the conveyance or packaging of goods, of plastics
2016-10-0038011000Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite)
2016-10-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-10-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2016-10-0085369085Electrical apparatus for making connections to or in electrical circuits, for a voltage <= 1.000 V (excl. fuses, circuit breakers and other apparatus for protecting electrical circuits, relays and other switches, lamp holders, plugs and sockets, prefabricated elements for electrical circuits and other connections and contact elements for wire and cables and for wafer probers)
2016-10-0085415000Semiconductor devices, n.e.s.
2016-09-0038011000Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite)
2016-09-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-09-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2016-09-0084279000Works trucks fitted with lifting or handling equipment, not self-propelled
2016-09-0090211010Orthopaedic appliances
2016-09-0090319085Parts and accessories for instruments, appliances and machines for measuring and checking, n.e.s.
2016-08-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-08-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2016-08-0084861000Machines and apparatus for the manufacture of boules or wafers
2016-08-0084869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2016-07-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2016-07-0084219900Parts of machinery and apparatus for filtering or purifying liquids or gases, n.e.s.
2016-07-0068042290Millstones, grindstones, grinding wheels and the like, without frameworks, for sharpening, polishing, trueing or cutting, of agglomerated natural abrasives or ceramics (excl. of agglomerated synthetic or natural diamond, hand sharpening or polishing stones, perfumed pumice stones, and grinding wheels etc. specifically for dental drill engines)
2016-06-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-06-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2016-06-0084861000Machines and apparatus for the manufacture of boules or wafers
2016-06-0084869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2016-05-0025061000Quartz (excl. quartz sands)
2016-05-0038011000Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite)
2016-05-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-05-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2016-05-0084219900Parts of machinery and apparatus for filtering or purifying liquids or gases, n.e.s.
2016-05-0084861000Machines and apparatus for the manufacture of boules or wafers
2016-05-0085439000Parts of electrical machines and apparatus, having individual functions, n.e.s. in chapter 85
2016-04-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-04-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2016-03-0025
2016-03-0038180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2016-03-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2016-02-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2016-02-0068151090Articles of graphite or other carbon, for non-electrical purposes (excl. carbon fibres and articles of carbon fibres)
2016-02-0070200010Glassware of fused quartz or other fused silica, n.e.s.
2016-02-0084219900Parts of machinery and apparatus for filtering or purifying liquids or gases, n.e.s.
2016-02-0084818099Appliances for pipes, boiler shells, tanks, vats or the like (excl. pressure-reducing valves, valves for the control of pneumatic power transmission, check "non-return" valves, safety or relief valves, taps, cocks and valves for sinks, baths and similar fixtures, central heating radiator valves, valves for pneumatic tyres and inner-tubes, process control valves, globe valves, gate valves, ball and plug valves, butterfly valves and diaphragm valves)
2016-02-0084861000Machines and apparatus for the manufacture of boules or wafers
2016-01-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2016-01-0085419000Parts of diodes, transistors and similar semiconductor devices; photosensitive semiconductor devices, light emitting diodes and mounted piezoelectric crystals, n.e.s.
2015-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2015-06-0038180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-04-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-02-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2014-01-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-12-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-11-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-10-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-09-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-08-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-07-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-06-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-05-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-05-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-05-0190271010Electronic gas or smoke analysis apparatus
2013-04-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-04-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-03-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-03-0185414090Photosensitive semiconductor devices, incl. photovoltaic cells
2013-02-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2013-02-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2013-01-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-12-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-11-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-10-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-09-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-09-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-07-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-06-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-05-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-04-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-04-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-04-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2012-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-02-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2012-02-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2012-01-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-12-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-11-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-10-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-09-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-08-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-08-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2011-07-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-07-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-07-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2011-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-06-0184869010Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays
2011-05-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-05-0184869010Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays
2011-05-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2011-04-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-03-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-03-0184869010Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays
2011-03-0185149000Parts of electric industrial or laboratory furnaces and ovens, incl. of those functioning by induction or dielectric loss, and of industrial or laboratory equipment for the heat treatment of materials by induction or dielectric loss, n.e.s. (other than for the manufacture of semiconductor devices on semiconductor wafers)
2011-02-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2011-02-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-02-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2011-01-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2011-01-0184669300
2011-01-0184862090Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits (excl. machine tools for working any material by removal of material operated by ultrasonic processes)
2011-01-0185415000Semiconductor devices, n.e.s.
2010-12-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-12-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-12-0184661020Arbors, collets and sleeves for use as tool holders in machine tools, incl. tool holders for any type of tool for working in the hand
2010-12-0184669195Parts and accessories for machine tools for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold-working glass, n.e.s. (excl. of cast iron or cast steel)
2010-12-0184669400Parts and accessories for machine tools for working metal without removing material, n.e.s.
2010-11-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-11-0184669300
2010-10-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-10-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-10-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-10-0185423990Electronic integrated circuits (excl. in the form of multichip integrated circuits and such as processors, controllers, memories and amplifiers)
2010-09-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-09-0138220000Diagnostic or laboratory reagents on a backing, prepared diagnostic or laboratory reagents whether or not on a backing, and certified reference materials (excl. compound diagnostic reagents designed to be administered to the patient, blood-grouping reagents, animal blood prepared for therapeutic, prophylactic or diagnostic uses and vaccines, toxins, cultures of micro-organisms and similar products)
2010-09-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-09-0185414010Light-emitting diodes, incl. laser diodes
2010-08-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-08-0184213100Intake air filters for internal combustion engines
2010-08-0184669195Parts and accessories for machine tools for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold-working glass, n.e.s. (excl. of cast iron or cast steel)
2010-08-0184862090Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits (excl. machine tools for working any material by removal of material operated by ultrasonic processes)
2010-08-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-07-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-07-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-07-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-07-0185414090Photosensitive semiconductor devices, incl. photovoltaic cells
2010-06-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-06-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-06-0181129930Articles of niobium "columbium" or rhenium, n.e.s.
2010-06-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-05-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-05-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-05-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-05-0185415000Semiconductor devices, n.e.s.
2010-04-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-04-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-04-0184864000Machines and apparatus specified in NoteĀ 9 C to chapter 84
2010-04-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-03-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-03-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-03-0184669400Parts and accessories for machine tools for working metal without removing material, n.e.s.
2010-03-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-02-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-02-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-02-0184669195Parts and accessories for machine tools for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold-working glass, n.e.s. (excl. of cast iron or cast steel)
2010-02-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-02-0190308200Instruments and apparatus for measuring or checking semiconductor wafers or devices
2010-01-0138180010Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion)
2010-01-0138180090Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)
2010-01-0184869090Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio
2010-01-0185176200Machines for the reception, conversion and transmission or regeneration of voice, images or other data, incl. switching and routing apparatus (excl. telephone sets, telephones for cellular networks or for other wireless networks)
2010-01-0190278013Electronic apparatus and equipment for performing measurements of the physical properties of semiconductor materials or of LCD substrates or associated insulating or conductive layers during the semiconductor wafer production process or the LCD production process

For goods imported into the United Kingdom, only imports originating from outside the EU are shown

Government Grants / Awards
Technology Strategy Board Awards
IQE PLC has been awarded 2 awards from the Technology Strategy Board. The value of these awards is £ 147,682

CategoryAward Date Award/Grant
Hi-grade waste heat recovery utilising III-V Thermo-photovoltaic materials : Collaborative Research and Development 2012-09-01 £ 40,000
High performance Solar Cell Fabrication (SolarFAB) : Collaborative Research and Development 2011-09-01 £ 107,682

How is this useful? The company may be investing in new products to generate new revenue streams or investing in new technologies to increase productivity / reduce costs. The company may own IPR as a result.

European Union CORDIS Awards
The European Union has not awarded IQE PLC any grants or awards.
Capital & Shareholder / Members
Stock Exchange Listing
London Stock Exchange Listing AIM
Ticker Name IQE
Listed Since 30-Sep-03
Market Sector Technology Hardware & Equipment
Market Sub Sector Semiconductors
Market Capitalisation £136.532M
Shares Issues 587,233,920.00
Share Type ORD GBP0.01
Ownership
    We could not find any group structure information
    Is this data useful to you?
    If you found the data here useful, PLEASE HELP US. We are a start-up and believe in making information freely available. Please DONATE to help.
    Alternatively by linking to us, posting on twitter, facebook and linkedin about us and generally spreading the word, you'll help us to grow. Our vision is to provide high quality data about the activities of all the companies in the world and where possible make it free to use and view. Finding and integrating data from thousands of data sources is time consuming and needs lots of effort. By simply spreading the word about us, you will help us.
    Need more information?
    We offer bespoke investigations into companies. If you need more information about this company we can gather more information as directed by you. This may, for example, be a forensic investigation such as tracing hidden assets. The engagement is on a time and materials basis. We charge GBP £ 500 per day + VAT. Contact us with a description of what you're looking for and we will assess whether we can help.