Active
Company Information for IQE PLC
PASCAL CLOSE, ST MELLONS, CARDIFF, SOUTH GLAMORGAN, CF3 0LW,
|
Company Registration Number
03745726
Public Limited Company
Active |
Company Name | |||
---|---|---|---|
IQE PLC | |||
Legal Registered Office | |||
PASCAL CLOSE ST MELLONS CARDIFF SOUTH GLAMORGAN CF3 0LW Other companies in CF3 | |||
| |||
Company Number | 03745726 | |
---|---|---|
Company ID Number | 03745726 | |
Date formed | 1999-04-01 | |
Country | ||
Origin Country | United Kingdom | |
Type | Public Limited Company | |
CompanyStatus | Active | |
Lastest accounts | 31/12/2022 | |
Account next due | 30/06/2024 | |
Latest return | 01/04/2016 | |
Return next due | 29/04/2017 | |
Type of accounts | GROUP | |
VAT Number /Sales tax ID | GB736457608 |
Last Datalog update: | 2024-03-06 05:28:37 |
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Officer | Role | Date Appointed |
---|---|---|
JASON MARK HOWELLS |
||
GODFREY HOWARD HARRISON AINSWORTH |
||
DAVID GRANT |
||
DEREK WILLIAM JONES |
||
ANDREW WILLIAM NELSON |
||
PHILIP PATRICK SMITH |
||
HOWARD ROBERT WILLIAMS |
Officer | Role | Date Appointed | Date Resigned |
---|---|---|---|
PHILLIP JOHN RASMUSSEN |
Director | ||
SIMON JOHN GIBSON |
Director | ||
PHILLIP JOHN RASMUSSEN |
Company Secretary | ||
ADRIAN GILMOUR MELDRUM |
Director | ||
JAMES LESLIE COVENTRY |
Company Secretary | ||
STUART ANDREW HALL |
Director | ||
MICHAEL DARAK SCOTT |
Director | ||
MARTIN STEVEN MARK LAMB |
Director | ||
STEPHEN BYARS |
Director | ||
THOMAS HIERL |
Director | ||
RICHARD JOHN GEORGE CLARKE |
Director | ||
SCOTT MASSIE |
Director | ||
GLEN BRESSNER |
Director | ||
FILBUK (SECRETARIES) LIMITED |
Company Secretary | ||
FILBUK NOMINEES LIMITED |
Director |
Officer | Related Company | Role | Date Appointed | Role Status | Incorporation date | Company Status |
---|---|---|---|---|---|---|
EPI HOLDINGS LIMITED | Director | 2018-04-10 | CURRENT | 1996-03-11 | Active | |
COMPOUND SEMICONDUCTOR CENTRE LIMITED | Director | 2018-04-09 | CURRENT | 2014-09-09 | Active | |
NANOGAN LIMITED | Director | 2018-04-09 | CURRENT | 2007-03-26 | Active | |
IQE (EUROPE) LIMITED | Director | 1997-06-20 | CURRENT | 1987-03-09 | Active | |
COMPOUND SEMICONDUCTOR CENTRE LIMITED | Director | 2014-09-09 | CURRENT | 2014-09-09 | Active | |
LLANSANNOR MANAGEMENT CONSULTANTS LTD | Director | 2012-07-27 | CURRENT | 2012-07-27 | Active | |
OYSTER INNOVATIONS LIMITED | Director | 2012-04-17 | CURRENT | 2012-02-14 | Active | |
NANOGAN LIMITED | Director | 2009-10-07 | CURRENT | 2007-03-26 | Active | |
LLANSANNOR HOUSE HOLDINGS LIMITED | Director | 2009-03-23 | CURRENT | 2009-03-23 | Active | |
TRUELUX GROUP LIMITED | Director | 2009-03-23 | CURRENT | 2009-03-23 | Active | |
IQE SILICON COMPOUNDS LIMITED | Director | 2000-12-01 | CURRENT | 2000-05-05 | Active | |
WAFER TECHNOLOGY INTERNATIONAL LIMITED | Director | 2000-11-22 | CURRENT | 1994-05-12 | Active | |
WAFER TECHNOLOGY LIMITED | Director | 2000-11-22 | CURRENT | 1984-07-03 | Active | |
EPI HOLDINGS LIMITED | Director | 1996-05-24 | CURRENT | 1996-03-11 | Active | |
IQE (EUROPE) LIMITED | Director | 1992-10-26 | CURRENT | 1987-03-09 | Active | |
TECHSKILLS ORGANISATION | Director | 2018-03-13 | CURRENT | 2010-04-14 | Active | |
BE THE BUSINESS TRADING LTD | Director | 2017-08-01 | CURRENT | 2017-08-01 | Active | |
THE TECH PARTNERSHIP | Director | 2011-06-06 | CURRENT | 2000-06-16 | Active - Proposal to Strike off | |
COMPOUND SEMICONDUCTOR CENTRE LIMITED | Director | 2015-07-06 | CURRENT | 2014-09-09 | Active | |
IQE (EUROPE) LIMITED | Director | 1998-01-01 | CURRENT | 1987-03-09 | Active |
Date | Document Type | Document Description |
---|---|---|
DIRECTOR APPOINTED JUTTA MEIER | ||
29/01/24 STATEMENT OF CAPITAL GBP 9615536.92 | ||
DIRECTOR APPOINTED MARIA MARCED | ||
DIRECTOR APPOINTED MR BAMDAD BASTANI | ||
APPOINTMENT TERMINATED, DIRECTOR DEREK WILLIAM JONES | ||
21/09/23 STATEMENT OF CAPITAL GBP 9615086.92 | ||
25/08/23 STATEMENT OF CAPITAL GBP 9614802.06 | ||
13/07/23 STATEMENT OF CAPITAL GBP 9614647.68 | ||
Resolutions passed:<ul><li>Resolution passed removal of pre-emption<li>Resolution on securities</ul> | ||
DIRECTOR APPOINTED MR HARMESH KUMAR SUNIARA | ||
GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/22 | ||
26/06/23 STATEMENT OF CAPITAL GBP 9613554.55 | ||
19/05/23 STATEMENT OF CAPITAL GBP 9612339.72 | ||
APPOINTMENT TERMINATED, DIRECTOR TIMOTHY NEIL PULLEN | ||
27/04/23 STATEMENT OF CAPITAL GBP 8055184.63 | ||
CONFIRMATION STATEMENT MADE ON 01/04/23, WITH NO UPDATES | ||
28/03/23 STATEMENT OF CAPITAL GBP 8052834.63 | ||
28/02/23 STATEMENT OF CAPITAL GBP 8049609.65 | ||
31/01/23 STATEMENT OF CAPITAL GBP 8048894.65 | ||
19/12/22 STATEMENT OF CAPITAL GBP 8048419.65 | ||
28/09/22 STATEMENT OF CAPITAL GBP 8047467.15 | ||
23/08/22 STATEMENT OF CAPITAL GBP 8046694.5 | ||
SH01 | 07/07/22 STATEMENT OF CAPITAL GBP 8046342.99 | |
RES10 | Resolutions passed:
| |
SH01 | 28/06/22 STATEMENT OF CAPITAL GBP 8045587.17 | |
GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/21 | ||
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/21 | |
SH01 | 27/05/22 STATEMENT OF CAPITAL GBP 8045562.17 | |
SH01 | 14/04/22 STATEMENT OF CAPITAL GBP 8044793.42 | |
RP04SH01 | Second filing of capital allotment of shares GBP8,035,557.56 | |
SH01 | 25/03/22 STATEMENT OF CAPITAL GBP 8044333.42 | |
CS01 | CONFIRMATION STATEMENT MADE ON 01/04/22, WITH NO UPDATES | |
SH01 | 25/02/22 STATEMENT OF CAPITAL GBP 8042475.58 | |
14/01/22 STATEMENT OF CAPITAL GBP 8041539.5 | ||
SH01 | 14/01/22 STATEMENT OF CAPITAL GBP 8041539.5 | |
DIRECTOR APPOINTED MR AMERICO LEMOS | ||
AP01 | DIRECTOR APPOINTED MR AMERICO LEMOS | |
23/12/21 STATEMENT OF CAPITAL GBP 8035557.56 | ||
SH01 | 23/12/21 STATEMENT OF CAPITAL GBP 8035557.56 | |
SH01 | 25/11/21 STATEMENT OF CAPITAL GBP 8033809.98 | |
SH01 | 28/10/21 STATEMENT OF CAPITAL GBP 8024397.43 | |
SH01 | 29/09/21 STATEMENT OF CAPITAL GBP 8022678.24 | |
TM01 | APPOINTMENT TERMINATED, DIRECTOR DAVID GRANT | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/20 | |
SH01 | 23/08/21 STATEMENT OF CAPITAL GBP 8022070.18 | |
AP01 | DIRECTOR APPOINTED VICTORIA HULL | |
SH01 | 19/07/21 STATEMENT OF CAPITAL GBP 8020473.11 | |
MEM/ARTS | ARTICLES OF ASSOCIATION | |
RES10 | Resolutions passed:
| |
SH01 | 01/07/21 STATEMENT OF CAPITAL GBP 8020064.79 | |
SH01 | 18/06/21 STATEMENT OF CAPITAL GBP 8013194.79 | |
SH01 | 28/05/21 STATEMENT OF CAPITAL GBP 8012999.33 | |
SH01 | 29/04/21 STATEMENT OF CAPITAL GBP 8012936.84 | |
CS01 | CONFIRMATION STATEMENT MADE ON 01/04/21, WITH NO UPDATES | |
CH01 | Director's details changed for Sir Derek William Jones on 2017-11-29 | |
SH01 | 31/03/21 STATEMENT OF CAPITAL GBP 8012414.89 | |
AD03 | Registers moved to registered inspection location of Equiniti Limited Aspect House Spencer Road Lancing West Sussex BN99 6DA | |
AD02 | Register inspection address changed to Equiniti Limited Aspect House Spencer Road Lancing West Sussex BN99 6DA | |
SH01 | 26/02/21 STATEMENT OF CAPITAL GBP 8011327.18 | |
SH01 | 29/01/21 STATEMENT OF CAPITAL GBP 8007900.79 | |
SH01 | 02/12/20 STATEMENT OF CAPITAL GBP 8002407.36 | |
SH01 | 04/11/20 STATEMENT OF CAPITAL GBP 8001873.33 | |
RP04SH01 | Second filing of capital allotment of shares GBP7,972,827.98 | |
SH01 | 02/09/20 STATEMENT OF CAPITAL GBP 7972832.52 | |
SH01 | 05/08/20 STATEMENT OF CAPITAL GBP 7971329.51 | |
SH01 | 01/07/20 STATEMENT OF CAPITAL GBP 7970479.51 | |
RP04AP01 | Second filing of director appointment of David Grant | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/19 | |
RES11 | Resolutions passed:
| |
SH01 | 03/06/20 STATEMENT OF CAPITAL GBP 7968158.87 | |
SH01 | 15/04/20 STATEMENT OF CAPITAL GBP 7964558.82 | |
CS01 | CONFIRMATION STATEMENT MADE ON 01/04/20, WITH NO UPDATES | |
SH01 | 03/02/20 STATEMENT OF CAPITAL GBP 7963534.79 | |
SH01 | 01/05/19 STATEMENT OF CAPITAL GBP 7831405.51 | |
AP03 | Appointment of Mr Thomas Andrew Dale as company secretary on 2020-03-19 | |
TM02 | Termination of appointment of Link Company Matters Limited on 2020-03-19 | |
AP04 | Appointment of Link Company Matters Limited as company secretary on 2019-12-20 | |
TM02 | Termination of appointment of Jason Mark Howells on 2019-12-20 | |
TM01 | APPOINTMENT TERMINATED, DIRECTOR HOWARD ROBERT WILLIAMS | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/18 | |
TM01 | APPOINTMENT TERMINATED, DIRECTOR GODFREY HOWARD HARRISON AINSWORTH | |
AP01 | DIRECTOR APPOINTED ELLEN CAROL TREDWAY CHESNEY | |
CS01 | CONFIRMATION STATEMENT MADE ON 01/04/19, WITH UPDATES | |
AP01 | DIRECTOR APPOINTED MR TIMOTHY NEIL PULLEN | |
MR01 | REGISTRATION OF A CHARGE / CHARGE CODE 037457260015 | |
MR01 | REGISTRATION OF A CHARGE / CHARGE CODE 037457260014 | |
MR01 | REGISTRATION OF A CHARGE / CHARGE CODE 037457260013 | |
MR04 | STATEMENT OF SATISFACTION OF A CHARGE / FULL / CHARGE CODE 8 | |
CH01 | Director's details changed for Mr Philip Patrick Smith on 2018-11-07 | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/17 | |
RES10 | Resolutions passed:
| |
LATEST SOC | 10/04/18 STATEMENT OF CAPITAL;GBP 7561517.46 | |
CS01 | CONFIRMATION STATEMENT MADE ON 01/04/18, WITH UPDATES | |
TM01 | APPOINTMENT TERMINATED, DIRECTOR PHILLIP JOHN RASMUSSEN | |
LATEST SOC | 08/12/17 STATEMENT OF CAPITAL;GBP 7556708.2 | |
SH01 | 16/11/17 STATEMENT OF CAPITAL GBP 7556708.2 | |
AP01 | DIRECTOR APPOINTED SIR DEREK WILLIAM JONES | |
CH01 | Director's details changed for Dr David Grant on 2017-12-01 | |
MEM/ARTS | ARTICLES OF ASSOCIATION | |
RES01 | ADOPT ARTICLES 13/11/17 | |
PSC08 | Notification of a person with significant control statement | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/16 | |
TM01 | APPOINTMENT TERMINATED, DIRECTOR SIMON JOHN GIBSON | |
LATEST SOC | 11/04/17 STATEMENT OF CAPITAL;GBP 6764855.54 | |
CS01 | CONFIRMATION STATEMENT MADE ON 01/04/17, WITH UPDATES | |
TM02 | Termination of appointment of Phillip John Rasmussen on 2017-03-15 | |
AP03 | Appointment of Mr Jason Mark Howells as company secretary on 2017-03-15 | |
AP01 | DIRECTOR APPOINTED MR PHILIP PATRICK SMITH | |
MR01 | REGISTRATION OF A CHARGE / CHARGE CODE 037457260011 | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/15 | |
LATEST SOC | 07/04/16 STATEMENT OF CAPITAL;GBP 6655331.7 | |
AR01 | 01/04/16 FULL LIST | |
MR01 | REGISTRATION OF A CHARGE / CHARGE CODE 037457260010 | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/14 | |
LATEST SOC | 28/04/15 STATEMENT OF CAPITAL;GBP 6603277.67 | |
AR01 | 01/04/15 FULL LIST | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/13 | |
LATEST SOC | 08/05/14 STATEMENT OF CAPITAL;GBP 6475136.61 | |
AR01 | 01/04/14 FULL LIST | |
RES13 | RPTS RECEIVED, AUDS & OFFICERS RE-APP 22/05/2013 | |
RES01 | ADOPT ARTICLES 22/05/2013 | |
MEM/ARTS | ARTICLES OF ASSOCIATION | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/12 | |
AR01 | 01/04/13 FULL LIST | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / MR PHILLIP JOHN RASMUSSEN / 28/04/2013 | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / HOWARD ROBERT WILLIAMS / 28/04/2013 | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / MR ANDREW WILLIAM NELSON / 28/04/2013 | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / PROFESSOR SIMON JOHN GIBSON / 27/04/2013 | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / HOWARD ROBERT WILLIAMS / 28/04/2013 | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / MR PHILLIP JOHN RASMUSSEN / 28/04/2013 | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / MR ANDREW WILLIAM NELSON / 28/04/2013 | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / PROFESSOR SIMON JOHN GIBSON / 28/04/2013 | |
CH03 | SECRETARY'S CHANGE OF PARTICULARS / MR PHILLIP JOHN RASMUSSEN / 28/04/2013 | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / DR GODFREY HOWARD HARRISON AINSWORTH / 28/04/2013 | |
MG01 | DUPLICATE MORTGAGE CERTIFICATECHARGE NO:9 | |
MG01 | PARTICULARS OF A MORTGAGE OR CHARGE / CHARGE NO: 9 | |
AP01 | DIRECTOR APPOINTED DR DAVID GRANT | |
TM01 | APPOINTMENT TERMINATED, DIRECTOR ADRIAN MELDRUM | |
MG01 | PARTICULARS OF A MORTGAGE OR CHARGE / CHARGE NO: 8 | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/11 | |
AR01 | 01/04/12 NO MEMBER LIST | |
MG02 | DECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 6 | |
MG02 | DECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 5 | |
AR01 | 01/04/11 BULK LIST | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/10 | |
MG01 | PARTICULARS OF A MORTGAGE OR CHARGE / CHARGE NO: 7 | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / DR GODFREY HOWARD HARRISON AINSWORTH / 10/08/2010 | |
AP01 | DIRECTOR APPOINTED MR ADRIAN GILMOUR MELDRUM | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/09 | |
AR01 | 01/04/10 BULK LIST | |
CH01 | DIRECTOR'S CHANGE OF PARTICULARS / DR GODFREY HOWARD HARRISON AINSWORTH / 09/11/2009 | |
SH01 | 31/01/10 STATEMENT OF CAPITAL GBP 4435006 | |
SH01 | 06/08/09 STATEMENT OF CAPITAL GBP 1647080.34 | |
SH01 | 30/06/09 STATEMENT OF CAPITAL GBP 1646940.24 | |
88(2) | AD 14/07/09 GBP SI 34809@0.01=348.09 GBP IC 4348119.13/4348467.22 | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/08 | |
363a | RETURN MADE UP TO 01/04/09; FULL LIST OF MEMBERS | |
88(2) | AD 29/05/09 GBP SI 1140824@0.01=11408.24 GBP IC 4336710.89/4348119.13 | |
353 | LOCATION OF REGISTER OF MEMBERS | |
88(2) | AD 01/05/09 GBP SI 61450@0.01=614.5 GBP IC 4336096.39/4336710.89 | |
88(2) | AD 03/04/09 GBP SI 276871@0.01=2768.71 GBP IC 4333327.68/4336096.39 | |
88(2) | AD 06/04/09 GBP SI 69307@0.01=693.07 GBP IC 4332634.61/4333327.68 | |
288a | SECRETARY APPOINTED MR PHILLIP JOHN RASMUSSEN | |
288b | APPOINTMENT TERMINATED SECRETARY JAMES COVENTRY | |
88(2) | AD 25/11/08 GBP SI 6320@0.01=63.2 GBP IC 4332571.41/4332634.61 | |
OC138 | REDUCTION OF ISS CAPITAL AND MINUTE (OC) | |
CERT21 | REDUCTION OF SHARE PREMIUM | |
OC138 | REDUCTION OF ISS CAPITAL AND MINUTE (OC) | |
88(2) | AD 02/10/08 GBP SI 54496@0.01=544.96 GBP IC 4332026.45/4332571.41 | |
88(2) | AD 08/10/08 GBP SI 172550@0.01=1725.5 GBP IC 4330300.95/4332026.45 | |
88(2) | AD 09/09/08 GBP SI 592772@0.01=5927.72 GBP IC 4324373.23/4330300.95 | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/07 | |
RES13 | OPTION SCHEME BE ALTERED, PREMIUM ACCOUNT RESOLUTION BE CANCELLED 21/07/2008 | |
RES10 | AUTHORISED ALLOTMENT OF SHARES AND DEBENTURES | |
403a | DECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 4 | |
403a | DECLARATION OF SATISFACTION IN FULL OR IN PART OF A MORTGAGE OR CHARGE /FULL /CHARGE NO 3 | |
363(190) | LOCATION OF DEBENTURE REGISTER ADDRESS CHANGED | |
363s | RETURN MADE UP TO 01/04/08; BULK LIST AVAILABLE SEPARATELY | |
395 | PARTICULARS OF MORTGAGE/CHARGE | |
395 | PARTICULARS OF MORTGAGE/CHARGE | |
287 | REGISTERED OFFICE CHANGED ON 06/11/07 FROM: PASCAL CLOSE, ST.MELLONS, CARDIFF, GLAMORGAN CF3 0LW | |
RES11 | DISAPPLICATION OF PRE-EMPTION RIGHTS | |
RES10 | AUTHORISED ALLOTMENT OF SHARES AND DEBENTURES | |
AA | GROUP OF COMPANIES' ACCOUNTS MADE UP TO 31/12/06 | |
363(190) | LOCATION OF DEBENTURE REGISTER ADDRESS CHANGED | |
363s | RETURN MADE UP TO 01/04/07; BULK LIST AVAILABLE SEPARATELY | |
288b | DIRECTOR RESIGNED | |
288a | NEW DIRECTOR APPOINTED | |
123 | NC INC ALREADY ADJUSTED 15/08/06 | |
RES10 | AUTHORISED ALLOTMENT OF SHARES AND DEBENTURES | |
RES04 | £ NC 5000000/6500000 31/0 |
Total # Mortgages/Charges | 17 |
---|---|
Mortgages/Charges outstanding | 10 |
Mortgages Partially Satisifed | 0 |
Mortgages Satisfied/Paid | 7 |
Charge Type | Date of Charge | Charge Status | Mortgagee |
---|---|---|---|
Outstanding | HSBC BANK PLC | ||
Outstanding | HSBC BANK PLC | ||
PLEDGE AGREEMENT | Outstanding | HSBC BANK PLC (THE COLLATERAL AGENT) | |
MASTER SECURITY AGREEMENT | Outstanding | RBS ASSET FINANCE INC | |
DEBENTURE | Outstanding | HSBC BANK PLC | |
DEBENTURE | Satisfied | LLOYDS TSB BANK PLC | |
OMNIBUS GUARANTEE AND SET-OFF AGREEMENT | Satisfied | LLOYDS TSB BANK PLC | |
GUARANTEE & DEBENTURE | Satisfied | BARCLAYS BANK PLC | |
DEED OF CHARGE OVER CREDIT BALANCES | Satisfied | BARCLAYS BANK PLC | |
DEED OF CHARGE OVER CREDIT BALANCES | Satisfied | BARCLAYS BANK PLC | |
DEED OF CHARGE OVER CREDIT BALANCES | Satisfied | BARCLAYS BANK PLC |
The top companies supplying to UK government with the same SIC code (70100 - Activities of head offices) as IQE PLC are:
Origin | Destination | Date | Import Code | Imported Goods classification description |
---|---|---|---|---|
38011000 | Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
68151090 | Articles of graphite or other carbon, for non-electrical purposes (excl. carbon fibres and articles of carbon fibres) | |||
38011000 | Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38190000 | Hydraulic brake fluids and other prepared liquids for hydraulic transmission not containing petroleum oil or bituminous mineral oil, or containing < 70% petroleum oil or bituminous mineral oil by weight | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869000 | ||||
85369001 | Prefabricated elements for electrical circuits, for a voltage of <= 1.000 V | |||
85369095 | ||||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
85340090 | Printed circuits consisting of conductor elements, contacts and other passive elements (excl. those with passive and active elements) | |||
85369095 | ||||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
90271010 | Electronic gas or smoke analysis apparatus | |||
38 | ||||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38011000 | Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
70200005 | Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor materials | |||
84799070 | ||||
85340090 | Printed circuits consisting of conductor elements, contacts and other passive elements (excl. those with passive and active elements) | |||
85369095 | ||||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84111100 | Turbojets of a thrust <= 25 kN | |||
90181100 | Electro-cardiographs | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
68151010 | Carbon fibres and articles of carbon fibres, for non-electrical purposes | |||
38011000 | Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
73181590 | Screws and bolts, of iron or steel "whether or not with their nuts and washers", with heads (excl. slotted and cross-recessed screws and bolts, hexagon head screws and bolts; wood screws, self-tapping screws and screws and bolts for fixing railway track construction material, screw hooks, screw rings and lag screws) | |||
81029900 | Articles of molybdenum, n.e.s. | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
39231000 | Boxes, cases, crates and similar articles for the conveyance or packaging of goods, of plastics | |||
38011000 | Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
85369085 | Electrical apparatus for making connections to or in electrical circuits, for a voltage <= 1.000 V (excl. fuses, circuit breakers and other apparatus for protecting electrical circuits, relays and other switches, lamp holders, plugs and sockets, prefabricated elements for electrical circuits and other connections and contact elements for wire and cables and for wafer probers) | |||
85415000 | Semiconductor devices, n.e.s. | |||
38011000 | Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84279000 | Works trucks fitted with lifting or handling equipment, not self-propelled | |||
90211010 | Orthopaedic appliances | |||
90319085 | Parts and accessories for instruments, appliances and machines for measuring and checking, n.e.s. | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84861000 | Machines and apparatus for the manufacture of boules or wafers | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84219900 | Parts of machinery and apparatus for filtering or purifying liquids or gases, n.e.s. | |||
68042290 | Millstones, grindstones, grinding wheels and the like, without frameworks, for sharpening, polishing, trueing or cutting, of agglomerated natural abrasives or ceramics (excl. of agglomerated synthetic or natural diamond, hand sharpening or polishing stones, perfumed pumice stones, and grinding wheels etc. specifically for dental drill engines) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84861000 | Machines and apparatus for the manufacture of boules or wafers | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
25061000 | Quartz (excl. quartz sands) | |||
38011000 | Artificial graphite (excl. retort graphite, retort carbon and goods of artificial graphite, incl. refractory materials based on artificial graphite) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84219900 | Parts of machinery and apparatus for filtering or purifying liquids or gases, n.e.s. | |||
84861000 | Machines and apparatus for the manufacture of boules or wafers | |||
85439000 | Parts of electrical machines and apparatus, having individual functions, n.e.s. in chapter 85 | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
25 | ||||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
68151090 | Articles of graphite or other carbon, for non-electrical purposes (excl. carbon fibres and articles of carbon fibres) | |||
70200010 | Glassware of fused quartz or other fused silica, n.e.s. | |||
84219900 | Parts of machinery and apparatus for filtering or purifying liquids or gases, n.e.s. | |||
84818099 | Appliances for pipes, boiler shells, tanks, vats or the like (excl. pressure-reducing valves, valves for the control of pneumatic power transmission, check "non-return" valves, safety or relief valves, taps, cocks and valves for sinks, baths and similar fixtures, central heating radiator valves, valves for pneumatic tyres and inner-tubes, process control valves, globe valves, gate valves, ball and plug valves, butterfly valves and diaphragm valves) | |||
84861000 | Machines and apparatus for the manufacture of boules or wafers | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
85419000 | Parts of diodes, transistors and similar semiconductor devices; photosensitive semiconductor devices, light emitting diodes and mounted piezoelectric crystals, n.e.s. | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
90271010 | Electronic gas or smoke analysis apparatus | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
85414090 | Photosensitive semiconductor devices, incl. photovoltaic cells | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869010 | Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869010 | Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869010 | Tool holders, self-opening dieheads and workholders of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays | |||
85149000 | Parts of electric industrial or laboratory furnaces and ovens, incl. of those functioning by induction or dielectric loss, and of industrial or laboratory equipment for the heat treatment of materials by induction or dielectric loss, n.e.s. (other than for the manufacture of semiconductor devices on semiconductor wafers) | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84669300 | ||||
84862090 | Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits (excl. machine tools for working any material by removal of material operated by ultrasonic processes) | |||
85415000 | Semiconductor devices, n.e.s. | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84661020 | Arbors, collets and sleeves for use as tool holders in machine tools, incl. tool holders for any type of tool for working in the hand | |||
84669195 | Parts and accessories for machine tools for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold-working glass, n.e.s. (excl. of cast iron or cast steel) | |||
84669400 | Parts and accessories for machine tools for working metal without removing material, n.e.s. | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84669300 | ||||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
85423990 | Electronic integrated circuits (excl. in the form of multichip integrated circuits and such as processors, controllers, memories and amplifiers) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
38220000 | Diagnostic or laboratory reagents on a backing, prepared diagnostic or laboratory reagents whether or not on a backing, and certified reference materials (excl. compound diagnostic reagents designed to be administered to the patient, blood-grouping reagents, animal blood prepared for therapeutic, prophylactic or diagnostic uses and vaccines, toxins, cultures of micro-organisms and similar products) | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
85414010 | Light-emitting diodes, incl. laser diodes | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84213100 | Intake air filters for internal combustion engines | |||
84669195 | Parts and accessories for machine tools for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold-working glass, n.e.s. (excl. of cast iron or cast steel) | |||
84862090 | Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits (excl. machine tools for working any material by removal of material operated by ultrasonic processes) | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
85414090 | Photosensitive semiconductor devices, incl. photovoltaic cells | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
81129930 | Articles of niobium "columbium" or rhenium, n.e.s. | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
85415000 | Semiconductor devices, n.e.s. | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84864000 | Machines and apparatus specified in NoteĀ 9 C to chapter 84 | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84669400 | Parts and accessories for machine tools for working metal without removing material, n.e.s. | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84669195 | Parts and accessories for machine tools for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold-working glass, n.e.s. (excl. of cast iron or cast steel) | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
90308200 | Instruments and apparatus for measuring or checking semiconductor wafers or devices | |||
38180010 | Silicon doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion) | |||
38180090 | Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon) | |||
84869090 | Parts and accessories for machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays, and for machines and apparatus specified in note 9 C to chapter 84, n.e.s. (excl. tool holders, self-opening dieheads, workholders, those of spinners for coating photographic emulsions, for physical deposition by sputtering, for dry-etching patterns, for chemical vapour depositio | |||
85176200 | Machines for the reception, conversion and transmission or regeneration of voice, images or other data, incl. switching and routing apparatus (excl. telephone sets, telephones for cellular networks or for other wireless networks) | |||
90278013 | Electronic apparatus and equipment for performing measurements of the physical properties of semiconductor materials or of LCD substrates or associated insulating or conductive layers during the semiconductor wafer production process or the LCD production process |
For goods imported into the United Kingdom, only imports originating from outside the EU are shown
Category | Award/Grant | |
---|---|---|
Hi-grade waste heat recovery utilising III-V Thermo-photovoltaic materials : Collaborative Research and Development | 2012-09-01 | £ 40,000 |
High performance Solar Cell Fabrication (SolarFAB) : Collaborative Research and Development | 2011-09-01 | £ 107,682 |
How is this useful? The company may be investing in new products to generate new revenue streams or investing in new technologies to increase productivity / reduce costs. The company may own IPR as a result.
London Stock Exchange Listing | AIM |
Ticker Name | IQE |
Listed Since | 30-Sep-03 |
Market Sector | Technology Hardware & Equipment |
Market Sub Sector | Semiconductors |
Market Capitalisation | £136.532M |
Shares Issues | 587,233,920.00 |
Share Type | ORD GBP0.01 |
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